Optical Module High-Density Packaging via Segmented Circuit Board
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Solution Overview
Problem
The challenge lies in integrating multiple chips and multi-channel optical components within a QSFP28 package, which poses a high-density packaging technology difficulty due to the complexity of interconnecting and aligning various optical paths efficiently.
Innovation Solution
The optical module incorporates a circuit board with a signal rate transmission chip, laser driver chip, transimpedance limiting amplifier chip, and photodetector chip array, connected via microstrip lines and gold wire bonding, along with ribbon optical cables and an MT ferrule for active coupling, optimizing the complexity of optical path coupling and achieving high-density packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple chips and multi-channel optical components are integrated in a QSFP28 package, then the interconnection ability and data exchange capability are improved, but the packaging complexity and alignment difficulty increase significantly
Solution Approach 1:
The patent divides the optical module into distinct functional segments: a circuit board carrying electrical components (signal rate transmission chip, laser driver chip, transimpedance limiting amplifier chip), a separate optical component module (MT ferrule with optical cables), and intermediate coupling structures. This segmentation allows independent optimization and simplification of each subsystem while maintaining high overall integration capability.
Solution Approach 2:
The patent employs three-dimensional spatial arrangement and multi-layer PCB design to accommodate multiple chips and optical components within the compact QSFP28 form factor. By utilizing vertical stacking, layered routing, and 3D packaging techniques, the design achieves high density integration without proportionally increasing packaging complexity.
2Adaptability or versatility
If multiple chips and multi-channel optical components are integrated in a QSFP28 package, then the interconnection ability and data exchange capability are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates pre-aligned optical assemblies and pre-positioned mounting structures where components are pre-assembled and pre-aligned before final integration into the QSFP28 package. The MT ferrule and optical cable assemblies are pre-configured with precise alignment features, reducing the precision demands during final assembly operations.
Solution Approach 2:
The patent introduces intermediary coupling structures such as optical benches, mounting substrates, and alignment fixtures that serve as reference frames between different optical components. These intermediaries provide stable mechanical references and facilitate precise alignment through standardized interfaces and registration features.
3Adaptability or versatility
If high-density integration is achieved in QSFP28 package, then the interconnection ability is improved, but the ease of manufacture decreases
Solution Approach 1:
The patent divides the optical module into distinct functional segments: a circuit board carrying electrical components (signal rate transmission chip, laser driver chip, transimpedance limiting amplifier chip), a separate optical component module (MT ferrule with optical cables), and intermediate coupling structures. This segmentation allows independent optimization and simplification of each subsystem while maintaining high overall integration capability.
Solution Approach 2:
The patent employs standardized interfaces and modular component designs that can be adapted across different optical module configurations. The circuit board layout, mounting patterns, and optical interfaces are designed with universal compatibility features, enabling the same basic architecture to support various channel configurations and optical component types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-density integration with improved reliability and efficiency in optical packaging, simplifying the optical path coupling process and enhancing coupling yield, making it suitable for mass production.
Implementation Method 1
the other end of the light-emitting ribbon optical cable is aligned with the vertical cavity surface emitting laser chip array by active coupling
Implementation Method 2
the light-receiving ribbon optical cable is aligned with the photodetector chip array by active coupling
Data Source
AI summary
The invention provides an optical module including a circuit board, an optical component and an electrical interface, and the circuit board is provided with a signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, a vertical cavity surface-emitting laser chip array and a photodetector chip array, and the signal rate transmission chip is electrically connected with the laser driver chip and the transimpedance limiting amplifier chip through the first microstrip line, and the optical component includes an interface end MT ferrule, and a light-emitting ribbon optical cable and a light-receiving ribbon optical cable both connected with the interface end MT ferrule, the light-emitting ribbon optical cable is coupled and aligned with the vertical cavity surface-emitting laser chip array, and the light-receiving ribbon optical cable is coupled and aligned with the photodetector chip array, and the electrical interface includes a gold finger disposed on one side of circuit board. The gold finger and the signal rate transmission chip are electrically connected through the second microstrip line. The present invention achieves a high-density optical package while optimizing the complexity of optical path coupling.