Optical Communication Module Alignment via Segmented Packaging
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Solution Overview
Problem
Conventional optical communication modules face performance degradation due to imprecise positioning of light emitting and receiving units, lenses, and optical fibers, which limits communication speed and increases costs and complexity.
Innovation Solution
The optical communication module incorporates a transparency maintaining unit with a transparent portion and an optical pass portion, allowing precise positioning of the photoelectric conversion device and lens, and uses a sealing method that does not require high precision, enabling accurate alignment and reduced part count, size, and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resin sealing method is used to package photoelectric conversion device and lens, then manufacturing process is simple, but positioning precision of optical components deteriorates
Solution Approach 1:
The patent divides the packaging structure into separate functional components: a lower packaging component that holds the photoelectric conversion device, an upper packaging component that holds the lens, and a transparent resin layer that seals and positions them. This segmentation allows each component to be manufactured and positioned independently with high precision, then assembled together, resolving the contradiction between positioning precision and manufacturing simplicity.
Solution Approach 2:
The patent implements preliminary positioning actions by forming positioning protrusions and recesses on the lower and upper packaging components before final assembly. The photoelectric conversion device and lens are pre-positioned in their respective components with high precision, and then the components are assembled together. This preliminary action ensures high positioning precision while keeping the overall manufacturing process manageable through modular assembly.
2Manufacturing precision
If high precision positioning structure is implemented, then alignment accuracy improves, but manufacturing cost and complexity increase
Solution Approach 1:
The packaging is segmented into modular components (lower packaging component, upper packaging component, transparent resin layer) that can be manufactured using standard processes. Each segment incorporates simple positioning features (protrusions and recesses) that achieve high alignment accuracy without requiring complex manufacturing techniques, thus reducing overall manufacturing cost and complexity while maintaining high precision.
Solution Approach 2:
The transparent resin layer acts as an intermediary that seals and positions the photoelectric conversion device and lens between the lower and upper packaging components. This intermediary element provides a simple yet effective means of achieving precise alignment and secure positioning without requiring complex mechanical structures, thereby reducing manufacturing complexity and cost while maintaining high alignment accuracy.
3Ease of manufacture
If photoelectric conversion device and lens are sealed together with resin, then manufacturing is simplified, but positioning precision deteriorates
Solution Approach 1:
The patent segments the sealing and positioning functions: the lower and upper packaging components provide rigid positioning structures with protrusions and recesses for high precision alignment, while the transparent resin layer provides sealing and additional positioning support. This segmentation allows the manufacturing process to remain simple (molding and assembly) while achieving high positioning precision through the structured packaging components.
Solution Approach 2:
The patent uses a composite packaging structure combining rigid packaging components (for precise mechanical positioning) with transparent resin material (for sealing and flexible positioning adjustment). This composite approach maintains manufacturing simplicity through standard molding processes while achieving high positioning precision through the synergistic combination of rigid structures and resin filling, resolving the contradiction between ease of manufacture and positioning precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances communication performance by ensuring precise alignment of optical components, reducing manufacturing costs, and simplifying the manufacturing process while maintaining high precision in component placement.
Implementation Method 1
a transparent portion passing light from one side to the other side
Implementation Method 2
a photoelectric conversion unit performing a photoelectric conversion from an optical signal to an electrical signal or from an electrical signal to an optical signal
Data Source
Figure 1
Figure 2A~2C
Figure 3
AI summary
An optical communication module and a method for manufacturing the optical communication module is expected to be provided, which can prevent deterioration in performance due to the positional aberration of photoelectric conversion unit in the photoelectric conversion device, lens, optical fiber and the like. A connector 21 and an optical receiver are arranged on the lower surface of the photodiode 20. A recess portion 12a is arranged with a peripheral wall 12 on the upper surface of basement 10 in an OSA 1, to support a conductive plate 30 having an opening portion 31. A lens 15 and a cylindrical portion 11 are arranged on the lower surface of basement 10. The basement 10, cylindrical portion 11, peripheral wall 12 and lens 15 are integrally formed with transparent synthetic resin. The photodiode 20 is connected to the conductive plate 30 inside the recess portion 12a, and then the recess portion 12a is sealed with a cover 40. The light come from an optical fiber 9 is collected by the lens 15, passed through the transparent basement 10, and received by the optical receiver of photodiode 20 through the opening portion 31 of conductive plate 30.