Optical Module Housing With Separate Cavities for Heat Dissipation
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Solution Overview
Problem
Optical modules face challenges in heat dissipation due to high power consumption, with existing methods like using a heat sink outside the module resulting in incomplete contact and high thermal resistance, leading to low heat dissipation efficiency.
Innovation Solution
The optical module incorporates a housing cover with separate heat dissipation cavities and a working medium for each device, utilizing capillary layers and thermal insulation to enhance heat transfer and reduce thermal contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is provided outside the optical module, then heat dissipation is implemented, but incomplete contact between surfaces results in high thermal contact resistance and low heat dissipation efficiency
Solution Approach 1:
The patent introduces a working medium (liquid or gas) as an intermediary between the optical devices and the external environment. This working medium fills the gaps and irregularities that cause poor contact between the heat sink and optical module surfaces, enabling complete thermal contact and efficient heat transfer without the high thermal contact resistance problems of direct solid-to-solid contact.
Solution Approach 2:
The patent utilizes a liquid or gas working medium within sealed cavities to transfer heat from the optical devices. This hydraulic/pneumatic approach allows the working medium to conform to all surface irregularities, ensuring complete thermal contact between the optical devices and the heat dissipation system, thereby eliminating the thermal contact resistance issues associated with traditional external heat sinks.
2Power
If performance of the optical module is increased, then power consumption increases, but heat dissipation becomes increasingly difficult
Solution Approach 1:
The patent divides the housing cover into multiple cavities (first cavity, second cavity, third cavity) that are spatially separated and independently configured. Each cavity can be optimized for specific heat dissipation requirements of different optical devices, allowing high-power devices to be isolated with dedicated heat dissipation paths, thus managing heat from high-performance devices without compromising overall module performance.
Solution Approach 2:
The patent employs a working medium that can undergo phase transitions (liquid-gas phase change) within the sealed cavities. This phase transition mechanism provides highly efficient heat absorption and dissipation, enabling the optical module to handle increased power consumption and heat generation from high-performance devices while maintaining effective thermal management.
3Adaptability or versatility
If multiple devices are disposed in the optical module, then functionality is enhanced, but thermal interference between devices increases
Solution Approach 1:
The patent segments the housing cover into multiple independent cavities (first cavity for first optical device, second cavity for second optical device, third cavity for heat sink). This segmentation physically isolates different optical devices from each other, preventing thermal interference while maintaining enhanced functionality through the coexistence of multiple devices with dedicated thermal management paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases heat dissipation efficiency by providing multiple pathways for heat transfer and reduces power density, protecting optical devices from thermal interference and improving overall module performance.
Implementation Method 1
heat of the first device is transferred by means of heat transfer to a surface of the housing cover close to the first device
Implementation Method 2
the working medium in the first cavity transfers the heat to a cavity surface of the first cavity facing away from the first device
Implementation Method 3
heat of the second device is transferred by means of heat transfer to a surface of the housing cover close to the second device
Implementation Method 4
the working medium in the second cavity transfers the heat to a cavity surface of the second cavity facing away from the second device
Implementation Method 5
utilizing capillary layers and thermal insulation to enhance heat transfer
Implementation Method 6
utilizing capillary layers and thermal insulation to enhance heat transfer and reduce thermal contact resistance
Data Source
Figure 1
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AI summary
Embodiments of this application provide an optical module and an optical communication system, to resolve a technical problem of low heat dissipation efficiency of an optical module. The optical module includes a first device, a second device, and a housing cover. The housing cover includes a first cavity and a second cavity. A working medium in the first cavity is used to dissipate heat from the first device, and a working medium in the second cavity is used to take away heat of the second device. For example, heat of the first device is transferred by means of heat transfer to a surface of the housing cover close to the first device, the heat enters the first cavity via the surface, the working medium in the first cavity transfers the heat to a cavity surface of the first cavity facing away from the first device, and then the heat is transferred to the outside of the optical module via the surface of the housing cover facing away from the first device. The use of separate heat dissipation of the first device and the second device allows for a reduction in power density (power consumption per unit area) on the surface of the housing cover, thereby reducing a dry contact temperature difference, and improving heat dissipation efficiency of the optical module.