Optical Module Assemblies Using Shared Layers for Batch Consistency
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Optical modules are often manufactured individually, leading to inefficiencies, high costs, and difficulty in maintaining consistency and quality across large numbers of modules.
Innovation Solution
Construct a plurality of optical modules as an assembly comprising a base, cover, and wall layers, with conductive vias forming a Faraday cage to prevent electromagnetic interference, and singulate into individual modules for consistent size and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical modules are manufactured individually piece-by-piece, then each module can be assembled with precision, but the manufacturing efficiency is low and costs are high
Solution Approach 1:
The patent applies segmentation by dividing the manufacturing process into two stages: first, constructing a large-scale assembly containing multiple optical modules sharing common structures (base layer, cover layer, wall layers, interior walls); second, singulating the assembly into individual modules. This allows efficient batch manufacturing of common components while maintaining individual module functionality.
Solution Approach 2:
The patent merges multiple optical modules into a single assembly structure where they share common base layers, cover layers, and wall layers. This consolidation enables simultaneous manufacturing of multiple modules, improving productivity while reducing per-unit costs through shared materials and processing steps.
2Manufacturing precision
If optical modules are manufactured individually, then quality control can be applied to each module, but it is difficult to maintain consistency across large numbers of modules
Solution Approach 1:
The patent segments the manufacturing process to first create a master assembly with precisely controlled common structures (base layer, cover layer, wall layers) that ensure consistency across all modules. The singulation process then divides this consistent assembly into individual modules, guaranteeing uniformity while enabling large-scale production.
Solution Approach 2:
By merging multiple modules into a single assembly with shared common structures, the patent ensures that all modules inherit the same precise dimensions and quality characteristics from the master assembly, maintaining consistency across large production volumes.
3Productivity
If modules are constructed as an assembly with shared layers, then manufacturing efficiency improves, but the device complexity increases
Solution Approach 1:
The patent segments the assembly into distinct functional layers (base layer, wall layers, cover layer) that can be independently manufactured and then combined. This modular layering approach simplifies the complexity by breaking down the complex assembly into manageable, standardized components.
Solution Approach 2:
The patent applies universality by designing common layers (base layer, cover layer, wall layers) that serve multiple functions: they provide structural support, define module boundaries, and are shared across all modules in the assembly. This multi-functionality reduces overall complexity by eliminating redundant components.
4Ease of operation
If individual modules are assembled separately, then each module is self-contained, but handling and mounting efficiency is reduced
Solution Approach 1:
The patent segments the final product delivery into two stages: first, transport and handle the complete assembly with all modules integrated; second, singulate into individual modules only when needed. This approach improves handling efficiency by dealing with a single unified structure rather than multiple separate modules.
Solution Approach 2:
By merging multiple modules into a single integrated assembly, the patent improves handling efficiency as the entire assembly can be transported, positioned, and mounted as one unit, reducing the complexity of handling and mounting multiple individual modules separately.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures consistent size and quality of individual modules, improving handling and mounting efficiency by constructing modules in batches, reducing costs and enhancing electromagnetic interference protection.
Implementation Method 1
conductive vias forming a Faraday cage to prevent electromagnetic interference
Data Source
AI summary
In accordance with various embodiments of the present disclosure, an assembly of a plurality of optical modules is provided. In some embodiments, the assembly comprises a base layer, and cover layer, and a wall layer. The base layer comprises one circuit board laminated substrate having a plurality of optical components mounted thereon. The cover layer comprises one circuit board laminated substrate having a plurality of apertures defined therein. Each of the plurality of apertures correspond to a respective one of the plurality of optical modules and align with a respective one of the plurality of optical components. The wall layer is coupled to the base layer and to the cover layer and forms a plurality of external walls. The base layer, the cover layer, and the wall layer together define a plurality of chambers, each corresponding to a respective one of the optical modules.