Optical Receiving Module With SOA for Long-Distance Signal Conversion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical modules face challenges in efficiently converting optical signals to electrical signals and vice versa, particularly in high-speed and long-distance optical communication systems, where signal loss and interference can occur, necessitating improved signal conversion and amplification mechanisms.
Innovation Solution
The optical module incorporates a light receiving assembly with a semiconductor optical amplifier (SOA) on a fourth substrate, electrically connected to a circuit board, which amplifies optical signals and converts them into electrical signals, utilizing a light receiving chip and optical amplification assembly within a light receiving cavity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If optical signals are transmitted over long distances, then communication coverage is improved, but signal loss and interference increase
Solution Approach 1:
An optical amplification assembly with semiconductor optical amplifier (SOA) is introduced as an intermediary component in the light receiving assembly. The SOA amplifies optical signals before they are converted to electrical signals by the light receiving chip, compensating for signal loss during long-distance transmission without requiring direct electrical connection between the light receiving assembly and circuit board
2Productivity
If electrical connection is made between light receiving assembly and circuit board, then signal conversion is enabled, but interference and signal loss occur
Solution Approach 1:
The electrical connection between the light receiving assembly and circuit board is extracted/removed. Instead, the light receiving chip converts optical signals to electrical signals internally within the light receiving assembly, and the amplified optical signals are transmitted to the circuit board through optical pathways, eliminating the harmful electrical connection that causes interference
3Power
If optical amplification is added to the system, then signal amplification is improved, but device complexity increases
Solution Approach 1:
The optical amplification assembly is merged with the light receiving assembly as an integrated unit. The semiconductor optical amplifier (SOA) is disposed within the light receiving cavity alongside the light receiving chip, combining amplification and signal reception functions in a single integrated structure rather than separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances signal conversion efficiency and amplification, reducing loss and interference in long-distance optical communication, enabling stable and reliable interconversion between optical and electrical signals.
Implementation Method 1
The optical amplification assembly is disposed in the light receiving cavity and is configured to amplify the optical signals, and the optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA)
Implementation Method 2
The light receiving chip is disposed in the light receiving cavity and is configured to receive the amplified optical signals
Data Source
AI summary
An optical module includes a circuit board and a light receiving assembly. The light receiving assembly is electrically connected to the circuit board and configured to receive optical signals from outside of the optical module. The light receiving assembly includes a light receiving cavity, an optical amplification assembly and a light receiving chip. The optical amplification assembly is disposed in the light receiving cavity and configured to amplify the optical signals. The optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA). The fourth substrate is electrically connected to the circuit board, and the SOA is disposed on the fourth substrate and is electrically connected to the fourth substrate, The light receiving chip is disposed in the light receiving cavity and configured to receive the amplified optical signals.