Semiconductor Optical Module Carrier with Solder Receptacle

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Solution Overview

Problem

The increasing demand for smaller optical modules with higher packing density leads to narrower spaces between components, making it challenging to maintain precise temperature control for laser diodes and drive them at high speeds while preventing solder issues that hinder component mounting and heat transfer.

Innovation Solution

A semiconductor optical module design featuring a carrier with chamfered corners to accommodate excess eutectic alloy, allowing for closer mounting and preventing solder balls, which includes a multi-layered ceramic side wall and a metal base with a eutectic alloy for secure fixation, ensuring reliable thermal conductivity and efficient component placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If packing density is increased to reduce module size, then volume is reduced, but solder oozing and solder ball formation occur causing manufacturing defects

Engineering Contradiction:

Improvemodule sizeVSAvoidsolder placement precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The invention extracts the excess solder from the problematic gap region by providing a dedicated receptacle structure on the carrier. The chamfered corner creates a recess that captures and contains the oozing solder, preventing it from forming solder balls that would contaminate the assembly and cause manufacturing defects.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention converts the harmful effect of solder oozing into a beneficial outcome by designing the chamfered corner receptacle to intentionally capture the excess solder. What would normally be a defect (solder overflow) becomes a controlled feature that prevents solder ball formation and ensures proper solder distribution.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Volume of moving object

If component spacing is reduced to increase packing density, then volume is reduced, but thermal management becomes more difficult

Engineering Contradiction:

Improvemodule sizeVSAvoidthermal management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The invention employs a composite structure combining the carrier substrate with integrated chamfered corner receptacles. This composite design allows the carrier to serve dual functions: mechanical support for components and thermal management through the solder receptacles that facilitate heat dissipation pathways.

Inventive Principle:

Principle #40Composite materials

3Volume of moving object

If component spacing is reduced to increase packing density, then volume is reduced, but reliability of solder joints deteriorates

Engineering Contradiction:

Improvemodule sizeVSAvoidsolder joint reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The invention extracts the excess solder from the gap between base and carrier, preventing it from forming solder balls that would compromise joint reliability. The chamfered corner receptacle captures the overflow solder, ensuring that the actual solder joints remain clean and reliable.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The chamfered corner receptacle provides a pre-designed cushioning space that anticipates and accommodates solder overflow before it can cause problems. This beforehand preparation prevents potential reliability issues by providing a designated area for excess solder to settle without interfering with critical joints.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables precise temperature control and high-speed operation of laser diodes by preventing solder issues, allowing for closer component placement and improved thermal management within the optical module, thus addressing the challenge of maintaining module compactness and performance.

Implementation Method 1

The side wall and the base forms a space into which the at least one semiconductor optical device and the carrier with the component are enclosed. A feature of the present invention is that the carrier provides a room in a corner facing the base and the side wall where the room may receive excess eutectic alloy that oozes out from a gap between the carrier and the base.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a eutectic alloy that fixes the carrier to the housing

Methodology Applied

Scientific EffectEutectic soldering: Soldering

Data Source

PatentUS10355442B2Semiconductor optical module providing carrier with structure for receiving excess solder

Publication Date: 2019.07.16 SUMITOMO ELECTRIC INDUSTRIES LTD

AI summary

An optical module that includes at least one semiconductor optical device, a carrier, a housing, and eutectic alloy that fixes the carrier to the housing is disclosed. The carrier mounts a component that couples with the semiconductor optical device. The housing, which includes a side wall made of ceramics and a base made of metal to form a space that encloses the semiconductor optical device, the carrier, and the component therein. The carrier provides a room facing the base and the side wall, where the room receives excess eutectic alloy oozing out from a gap between the carrier and the base.