Optical Module Spacer Design for Miniaturization

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Solution Overview

Problem

Conventional optical modules, such as the TO-CAN structure, face limitations in miniaturization due to manufacturing constraints, necessitating a new structure to enable cost-effective mass production and varied shapes for increased optical module density in high-speed communication systems.

Innovation Solution

An optical module design featuring a substrate with an optical device chip, a spacer with through holes, and a cover combined with the spacer to house an optical fiber, allowing for precise alignment and miniaturization, along with optional features like anti-reflective coatings, lenses, and wavelength-selective filters, to enhance optical coupling efficiency and reduce manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If TO-CAN structure is used, then manufacturing cost is reduced, but volume reduction is limited

Engineering Contradiction:
Improvemanufacturing costVSAvoidoptical module volume
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The optical module is divided into separate functional components: a substrate for mounting optical devices, a cover for sealing, and a spacer maintaining precise spacing between them. This segmentation allows each component to be optimized independently for both manufacturing ease and compact size, resolving the contradiction between low cost and miniaturization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from the conventional TO-CAN cylindrical structure to a planar substrate-based structure with defined spacing dimensions. By establishing precise spacing in multiple dimensions through the spacer design, the module achieves compact volume while maintaining manufacturability through standardized substrate and cover components.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If optical module size is reduced, then mounting density increases, but manufacturing precision requirements increase

Engineering Contradiction:
Improvemounting densityVSAvoidalignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The spacer acts as an intermediary component that pre-establishes precise spacing and alignment reference surfaces between the substrate and cover. This intermediary structure provides built-in alignment features that guide the positioning of optical devices and fibers, enabling high mounting density without proportionally increasing manufacturing precision requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The spacer is designed with pre-formed spacing dimensions and alignment features before assembly. By preparing the spacing structure in advance with precise geometric features, the invention eliminates the need for high-precision alignment during final assembly, thus enabling compact module size with relaxed manufacturing precision requirements.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8774578B2Optical module and manufacturing method thereof
Publication Date: 2014.07.08 XL PHOTONICS INC
  • US8774578B2 patent drawing
  • US8774578B2 patent drawing
  • US8774578B2 patent drawing

AI summary

An optical module includes a substrate including an optical device chip disposed on a top surface thereof, a spacer having at least one through hole and combined with the substrate on the substrate to insert the optical device chip into the through hole, a cover combined with the spacer on the spacer to stop the through hole, and an optical fiber combined with the cover on the cover in a position corresponding to a position of the optical device chip. The optical module is configured such that light transmitted through the optical fiber is incident to the optical device chip or light emitted from the optical device chip is incident to the optical fiber. The optical module may be downscaled and produced in large quantities at low cost.