Optical Module Stacked Optoelectronic Chips Thermal Management
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Solution Overview
Problem
The rapid increase in transmission speed of optical modules poses challenges in heat dissipation and miniaturization, as existing optical transmitting modules have limited capacity for optical components and poor heat dissipation, making it difficult to accommodate more components in a smaller housing.
Innovation Solution
The optical module design includes a housing with a main circuit board, optical transmitting and receiving assemblies, and an electrical connector, where optoelectronic chips are arranged in a stacked or side-by-side manner on substrates thermally connected to the housing, facilitating efficient heat dissipation and a more rational spatial layout, allowing for higher component density without the need for additional optical fiber receptacles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the transmission speed of optical modules is increased to meet network demands, then the network performance is improved, but heat dissipation problems worsen and the module size increases
Solution Approach 1:
The patent transitions from traditional planar arrangement of optical components to a three-dimensional stacked architecture. Multiple optoelectronic chip sets are arranged in vertical layers, with each layer containing optical components stacked above one another. This spatial reconfiguration increases component density while improving heat dissipation by distributing heat-generating components across multiple vertical levels, allowing heat to dissipate in multiple directions rather than concentrating on a single plane.
Solution Approach 2:
The optical module is divided into multiple independent functional layers, with each layer containing specific optoelectronic chip sets and optical components. This segmentation allows for modular heat management, where each layer can be independently thermally managed through dedicated heat dissipation structures. The layered segmentation also enables selective optimization of heat dissipation paths for different functional modules within the same package.
2Volume of moving object
If more optical components are accommodated in a smaller housing to increase component density, then the module size is reduced, but the arrangement complexity and heat dissipation difficulty increase
Solution Approach 1:
The patent employs vertical stacking of optoelectronic chip sets and optical components to transform the traditional two-dimensional planar layout into a three-dimensional architecture. Multiple sets of optoelectronic chips are arranged in vertical layers, with optical components positioned between or above these layers. This approach dramatically increases the number of components that can be accommodated within a compact housing volume while maintaining organized, manageable connections through standardized optical coupling interfaces between layers.
3Quantity of substance
If more optical components are accommodated in a smaller housing, then the component density is increased, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The patent arranges multiple sets of optoelectronic chips in vertical stacked layers, with each layer separated by optical components and heat dissipation structures. This vertical distribution spreads heat-generating components across multiple z-axis levels, creating multiple heat dissipation pathways toward the housing exterior. The optical components serving as intermediaries between chip layers also function as thermal management elements, conducting heat away from dense chip regions while maintaining optical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables effective heat dissipation and a higher component density within a limited space, addressing the challenges of high-speed transmission and miniaturization, allowing for the accommodation of more optical and electronic components, thus enhancing the performance of optical modules.
Implementation Method 1
optoelectronic chips, an optical assembly and an optical fiber receptacle... arranged in a stacked or side-by-side manner on substrates thermally connected to the housing, facilitating efficient heat dissipation
Data Source
AI summary
An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.