Optical Module Stacked Lasers Heat Dissipation
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Solution Overview
Problem
The rapid increase in transmission speed of optical modules poses challenges in heat dissipation and miniaturization, as existing optical transmitting modules have limited capacity for components and poor heat dissipation, making it difficult to accommodate more optical components in a smaller housing.
Innovation Solution
The optical module design includes a housing with a main circuit board, optical transmitting and receiving assemblies, and an electrical connector, where at least two sets of lasers and photoelectric detectors are arranged in a stacked manner on parallel planes, with substrates and optical fiber receptacles fixed together for efficient heat dissipation and compact layout, eliminating the need for separate optical fiber connections that occupy space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transmission speed of optical modules is increased to meet network traffic demands, then the network capacity and data transmission capability are improved, but the heat dissipation problem worsens and the module size cannot be reduced
Solution Approach 1:
The patent transitions from traditional planar arrangement of optical components to a three-dimensional stacked arrangement. Multiple laser chips and photoelectric detector chips are arranged in different layers vertically, with corresponding optical components positioned above and below each chip layer. This spatial transformation enables higher component density while maintaining effective heat dissipation paths in the vertical dimension.
2Volume of moving object
If more optical components are arranged in a smaller optical module housing to achieve miniaturization, then the device compactness is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent employs vertical stacking of multiple chip layers with optical components positioned in different vertical levels. This three-dimensional configuration allows the module to accommodate more components in a compact footprint while utilizing the vertical dimension for heat dissipation pathways, resolving the conflict between miniaturization and thermal management.
3Ease of manufacture
If traditional optical transmitting module design is used with separate optical fiber connections, then the assembly process is simpler, but the device complexity increases and space efficiency decreases
Solution Approach 1:
The patent integrates the optical fiber receptacle directly with the optical components and substrate, forming a unified assembly. This merging eliminates the need for separate optical fiber connection components and simplifies the overall structure, reducing both device complexity and space occupation while maintaining ease of assembly through standardized interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables effective heat dissipation and a more rational spatial layout, allowing for a higher density of components and faster transmission speeds within a limited space, addressing the challenges of accommodating more optical components and improving assembly convenience.
Implementation Method 1
The transmitting-end optical assembly orients light emitted from the at least two sets of lasers toward the transmitting-end optical fiber receptacle
Implementation Method 2
The transmitting-end optical assembly orients light emitted from the at least two sets of lasers toward the transmitting-end optical fiber receptacle
Implementation Method 3
The receiving-end optical assembly orients light from the receiving-end optical fiber receptacle toward the at least two sets of photoelectric detectors
Implementation Method 4
The at least two sets of lasers are arranged in a stacked manner on planes parallel to the plane on which the main circuit board is located
Data Source
AI summary
An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.