Optical Module Stem Layout for Compact High-Speed Signal Transmission

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional optical modules face challenges in reducing size due to the need for multiple pins and a large stem area, which hinders miniaturization and affects heat dissipation and high-frequency characteristics.

Innovation Solution

The optical module design eliminates the ground pin and incorporates protrusions on the stem for ground connection, allowing the flexible printed circuit board to make direct contact, enhancing heat dissipation and reducing the overall size by optimizing the stem's diameter and shape.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of components inside the optical module is increased to improve optical signal transmission, then the transmission performance is improved, but the device complexity and difficulty of assembly increase

Engineering Contradiction:
Improveoptical signal transmission performanceVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the optical component and the circuit board into a single integrated substrate. The optical component is directly mounted on the circuit board without requiring separate fixation structures, reducing the total component count while maintaining transmission performance. This integration eliminates the need for additional mounting brackets, fasteners, and alignment mechanisms that would otherwise be required.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board serves multiple functions: it acts as both the electrical connection platform and the mechanical support structure for the optical component. The substrate simultaneously provides electrical pathways, mechanical fixation, and thermal management, eliminating the need for separate dedicated support components and reducing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If traditional optical modules are designed with separate components for flexibility, then the adaptability is improved, but the assembly difficulty and time increase

Engineering Contradiction:
Improvedesign flexibilityVSAvoidassembly difficulty
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The optical component and circuit board are integrated into a single assembly unit that can be manufactured as one piece or pre-assembled as a module. This integrated structure maintains design flexibility through configurable substrate layouts while dramatically simplifying assembly, as the entire optical assembly can be installed as a single unit rather than requiring separate mounting of multiple components.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If the optical module uses standard packaging methods, then the manufacturing process is simple, but the module is prone to damage during transportation

Engineering Contradiction:
Improvepackaging simplicityVSAvoiddamage resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The optical module is designed as a self-contained integrated unit with the optical component, circuit board, and protective housing forming a single robust assembly. This segmentation allows the module to be handled and packaged as one unit rather than requiring complex packaging for multiple loose components, while the integrated structure inherently provides better protection against transportation damage.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves a significant reduction in size, improves high-frequency characteristics, and enhances heat dissipation, thereby increasing the reliability and transmission speed of the optical module.

Implementation Method 1

an optical module comprising a circuit board and an optical component mounted on the circuit board, wherein the optical component is in direct contact with the circuit board

Methodology Applied
Scientific EffectOptical signal transmission: Light

Data Source

PatentEP3667378B1Optical module
Publication Date: 2026.04.08 YOKOWO CO LTD
  • EP3667378B1 patent drawingFigure 1A~1C
  • EP3667378B1 patent drawingFigure 2A~2B
  • EP3667378B1 patent drawingFigure 3A~3B

AI summary

This optical module (100G) comprises a stem (11); lead pins (2a-2d) extending through the stem (1); glasses (3a-3d) filled between the stem (1) and the lead pins (2a-2d); elements (photodiode (4), amplifier (5)) disposed on a first main surface of the stem (1), and connected to the lead pins (2a-2d); FPC (7) in contact with a second main surface of the stem (1); a cap attachable to the stem (1); and an aligning-fixing parts (metal-made flange (22), Z-sleeve (23)) that aligns an optical fiber stub (24) with the cap (14) and fix the optical fiber stub (24) to the cap (14).