Optical Module 3D Subassembly Stacking for Compact WDM

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Solution Overview

Problem

Existing optical modules face challenges in reducing size and cost while maintaining performance, particularly in dense transmission applications, due to the integration of multiple optical subassemblies which require significant space and increase manufacturing costs.

Innovation Solution

The optical module incorporates a configuration with multiple optical subassemblies connected via flexible printed circuit boards and a printed circuit board, allowing for a simple and efficient arrangement that reduces size and cost by using a common structure for subassemblies and flexible printed circuit boards, and integrating a control IC for shared terminal connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple optical subassemblies are mounted in an optical module, then the optical module can achieve dense transmission with multiple wavelengths, but the size of the optical module increases

Engineering Contradiction:

Improvewavelength division multiplexing capabilityVSAvoidoptical module size

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent transitions from planar arrangement of optical subassemblies to three-dimensional arrangement by stacking subassemblies vertically. Multiple optical subassemblies are mounted on different layers of the printed circuit board, utilizing the Z-axis dimension to reduce the footprint area while maintaining the capability to support multiple wavelengths for dense transmission

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If multiple optical subassemblies are mounted in an optical module, then the optical module can support multiple wavelengths, but the manufacturing cost increases

Engineering Contradiction:

Improvewavelength division multiplexing capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the optical module into independent optical subassemblies, each containing a specific number of optical elements (e.g., 2 or 4 elements per subassembly). This segmentation allows for standardized manufacturing of subassemblies that can be mass-produced and then assembled into optical modules with different configurations, reducing overall manufacturing cost through economies of scale

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent designs optical subassemblies with universal interfaces and standardized mounting configurations that can be used across different optical module types. The same subassembly design can be deployed in various wavelength division multiplexing configurations, reducing design and tooling costs while maintaining versatility

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Device complexity

If optical elements are monolithically integrated on the same semiconductor substrate, then the device complexity is reduced, but the manufacturing cost increases due to individual process requirements

Engineering Contradiction:

Improveintegration structureVSAvoidmanufacturing cost

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

Instead of monolithic integration, the patent segments optical elements into separate optical subassemblies that are mounted on the printed circuit board. Each subassembly can be manufactured using standard semiconductor processes and then assembled, avoiding the need for complex monolithic integration processes while maintaining manageable device complexity through modular architecture

Inventive Principle:

Principle #1Segmentation

4Volume of moving object

If optical subassemblies are arranged three-dimensionally to reduce size, then the optical module size is reduced, but the connection complexity between subassemblies and terminals increases

Engineering Contradiction:

Improveoptical module sizeVSAvoidconnection structure

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent employs asymmetric arrangement of optical subassemblies relative to the printed circuit board, with subassemblies positioned at specific angles and orientations to optimize space utilization. The connection terminals are asymmetrically distributed on the board to match the three-dimensional subassembly layout, reducing the length and complexity of connection paths while maintaining compact form factor

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS10444452B2Optical module and optical transmission equipment

Publication Date: 2019.10.15 CAMBRIDGE IND USA INC

AI summary

There is provided an optical module, including a first optical subassembly, a second optical subassembly, a first flexible printed circuit board, and a second flexible printed circuit board. The first/second optical subassembly includes a first/second normal phase lead terminal and a first/second reverse phase lead terminal, arranged in a positive direction of a first orientation. The first/second flexible printed circuit board includes a first/second normal phase strip conductor, a first/second reverse phase strip conductor, and a ground conductor layer. The back surface of the first/second flexible printed circuit board faces the end surface of the first/second optical subassembly. The first/second normal phase strip conductor extends in a positive/negative direction of a second orientation.