Optical Module Substrate Grounding via Embedded Metal Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In optical communication systems, the interconversion between optical and electrical signals is challenging due to the fragility of gold wires used for connecting silicon photonic chips and laser assemblies to circuit boards, leading to potential short circuits and signal transmission issues.
Innovation Solution
The optical module design includes a substrate with support steps and metal layers to securely ground the silicon photonic chip, and a protective cover to encapsulate electrical connections, ensuring stable optical and electrical connections while preventing deformation of gold wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold wires are used to connect silicon photonic chips and laser assemblies to circuit boards, then electrical connections can be established, but the gold wires are fragile and prone to deformation and short circuits
Solution Approach 1:
The patent introduces a substrate as an intermediary component between the circuit board and the optical components (silicon photonic chip and laser assembly). The substrate provides robust electrical connection paths through metal layers embedded within it, replacing the fragile gold wires that directly connected these components to the circuit board. This mediator structure eliminates the deformation and short circuit issues while maintaining electrical connectivity.
Solution Approach 2:
The patent replaces the mechanical wire-bonding system with a more robust embedded metal layer system. Instead of using physical gold wires that are susceptible to mechanical stress and deformation, the electrical connections are established through metal layers (first metal layer and second metal layer) that are integrated into the substrate structure, providing superior mechanical strength and reliability.
2Reliability
If gold wires are used for connecting components, then electrical connections are established, but signal transmission issues occur due to wire fragility
Solution Approach 1:
The substrate acts as an intermediary that provides stable signal transmission paths through its embedded metal layers. This structure protects the signal transmission paths from the harmful effects of wire fragility, deformation, and external interference, ensuring reliable signal transmission between the optical components and the circuit board.
3Stability of the object's composition
If support steps are added to the substrate to support the circuit board, then structural stability is improved, but device complexity increases
Solution Approach 1:
The substrate is designed with multi-functionality: it provides electrical connection paths through metal layers, supports the circuit board mechanically through support steps, and positions the optical components. The support steps are integrated into the substrate structure itself, combining mechanical support and electrical connection functions in a single component, thereby improving structural stability without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of signal transmission by preventing deformation and damage to gold wires, ensuring stable optical and electrical connections and improving the overall performance of the optical module.
Implementation Method 1
an optical module is a tool for achieving interconversion between an optical signal and an electrical signal
Implementation Method 2
the first metal layer is electrically connected to the first support step... the second metal layer is electrically connected to the second support step
Data Source
AI summary
An optical module includes a circuit board, a substrate, a laser assembly, and a silicon photonic chip. The silicon photonic chip is electrically connected to the circuit board through the substrate so as to ground the silicon photonic chip. The substrate includes a body, a first support step, and a second support step. The first support step is disposed at an end of the body. The second support step is disposed at another end of the body. The circuit board includes a first metal layer and a second metal layer. The first metal layer is disposed on a surface of the circuit board proximate to the first support step and is electrically connected to the first support step. The second metal layer is disposed on a surface of the circuit board proximate to the second support step and is electrically connected to the second support step.