Optical Module Bonding to Supporting Plate for Thermal Stability
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Solution Overview
Problem
Existing optical devices face challenges in maintaining focus due to shrinkage from adhesive curing, tolerance issues, thermal behavior, and aging, which complicate the alignment and joining of optical modules with image recording elements, and often require complex designs with many components.
Innovation Solution
The optical device arrangement features an image recording element directly on a supporting plate, with the printed circuit board located below, allowing for a simpler design that separates components and improves thermal dissipation, and the optical module is directly bonded to the supporting plate, eliminating the need for an objective lens holder and reducing the impact of board influences on focusing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the image recording element is arranged on the printed circuit board and the optical module is joined to the printed circuit board, then the assembly is compact, but the focusing quality deteriorates due to shrinkage during adhesive curing and thermal behavior of the printed circuit board
Solution Approach 1:
The device is segmented into two separate mounting surfaces: the printed circuit board for electronic components and the supporting plate for optical components. This segmentation isolates the optical path from the printed circuit board's thermal and mechanical influences, eliminating focusing errors caused by board shrinkage and thermal expansion while maintaining compact assembly.
Solution Approach 2:
The supporting plate acts as an intermediary between the printed circuit board and the optical module. It provides a stable, thermally inert mounting surface for the optical module, decoupling it from the printed circuit board's thermal and mechanical behavior, thereby preserving focusing quality.
2Adaptability or versatility
If multiple components are arranged in layers (image recording element on printed circuit board, which is on supporting plate), then component integration is achieved, but the number of joining operations and manufacturing effort increases
Solution Approach 1:
The device structure is segmented into two independent mounting planes: the printed circuit board layer for electronics and the supporting plate layer for optics. This allows parallel processing and assembly of different components simultaneously, reducing the sequence of joining operations and simplifying manufacturing.
Solution Approach 2:
The arrangement transitions from a vertical stacking approach to a layered planar distribution, where the printed circuit board and supporting plate are positioned on different sides or planes. This dimensional reorganization reduces the number of intermediate joining steps while maintaining full component integration.
3Ease of operation
If the printed circuit board is positioned between the optical module and the supporting plate, then electrical connections are facilitated, but thermal dissipation and alignment stability of the optical module are compromised
Solution Approach 1:
The mounting structure is segmented into separate functional zones: the printed circuit board handles electrical connections for electronic components, while the supporting plate provides a dedicated stable platform for optical components. This segmentation ensures that electrical connection requirements do not compromise optical alignment stability.
Solution Approach 2:
The supporting plate serves as an intermediary mounting surface specifically for the optical module, isolating it from the printed circuit board's thermal and mechanical instabilities. This allows electrical connections to be maintained through the printed circuit board while optical alignment stability is preserved through the supporting plate.
4Ease of manufacture
If adhesive bonding is used to join the objective lens holder to the printed circuit board, then joining is simplified, but focusing quality deteriorates due to shrinkage during curing
Solution Approach 1:
The objective lens holder is extracted from the printed circuit board assembly and relocated to the supporting plate. This removal eliminates the harmful effect of adhesive shrinkage on focusing quality, as the optical module is now bonded to the thermally stable supporting plate rather than the shrinkage-prone printed circuit board.
Solution Approach 2:
The adhesive bonding process, which causes shrinkage and focusing errors when used with printed circuit boards, is redirected to bond the optical module to the supporting plate. The supporting plate's thermal and dimensional stability converts the potentially harmful adhesive shrinkage into a benign effect that does not compromise focusing quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes manufacturing effort, enhances robustness against tolerances and thermal effects, and reduces the number of components, resulting in a more stable and efficient optical device with improved long-term alignment and focusing performance.
Implementation Method 1
arranging the image recording element on the supporting plate results in a good thermal connection or thermal dissipation
Implementation Method 2
the optical module, in particular an objective lens, can be adhesively bonded directly to the supporting plate
Data Source
AI summary
An optical device includes an optical module, e.g. with an objective lens, a printed circuit board, an image recording element and a supporting plate. In one embodiment, the optical module and the image recording element are arranged on one side of the supporting plate, the printed circuit board is arranged on the opposite side of the supporting plate, and the image recording element and the printed circuit board are contacted to each other through one or more openings in the supporting plate. In another embodiment, the image recording element is arranged in an opening in the supporting plate and directly joined to the printed circuit board.