Optical Module Thermal Stack for IC and Optical Element Cooling
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Solution Overview
Problem
Existing optical modules face challenges in efficiently managing heat dissipation and temperature control of components like driver ICs and optical modulators, leading to performance deterioration and instability due to thermal stress and mismatched thermal expansion coefficients.
Innovation Solution
The optical module design incorporates a housing with a heat radiation plate, a thermoelectric cooler (TEC) for temperature control, and an interconnection board with specific adhesive layers and flip-chip assembly to ensure efficient heat dissipation and alignment, using conductive adhesives and materials with controlled thermal expansion coefficients to minimize thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermoelectric cooler (TEC) is used to cool the optical circuit element, then the temperature control capability is improved, but the device complexity increases due to additional components and assembly steps
Solution Approach 1:
The patent combines the TEC, optical circuit element, and housing into an integrated assembly where the TEC is mounted directly on the housing and the optical circuit element is mounted on the TEC, creating a unified thermal management system that reduces overall device complexity while maintaining temperature control capability
Solution Approach 2:
The housing serves multiple functions: it provides structural support, acts as a mounting platform for the TEC, and serves as a heat dissipation structure, thereby reducing the need for separate components and simplifying the overall device design
2Manufacturing precision
If flip-chip assembly is used to mount the IC and optical circuit element, then the manufacturing precision is improved, but the device complexity increases due to specialized assembly requirements
Solution Approach 1:
The patent applies adhesive layers to the housing and component surfaces before assembly, allowing components to be positioned and held in place during the flip-chip assembly process, thereby achieving high alignment precision without requiring complex real-time alignment mechanisms
Solution Approach 2:
The patent introduces adhesive layers as intermediary materials between the housing/TEC and the IC/optical circuit element, which simplifies the assembly process by providing a compliant bonding interface that accommodates minor misalignments and reduces the need for highly precise positioning mechanisms
3Manufacturing precision
If adhesives with different thicknesses are used for mounting components, then the alignment precision is improved, but the manufacturing complexity increases due to precise adhesive application requirements
Solution Approach 1:
The patent applies adhesive layers of different thicknesses at different locations: a first adhesive layer with a first thickness for mounting the IC and a second adhesive layer with a second thickness for mounting the optical circuit element, allowing each component to be positioned with optimal alignment precision while simplifying the overall manufacturing process through localized adhesive application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively maintains component temperatures within allowable ranges, reduces thermal stress, and enhances signal transmission quality by minimizing heat inflow and maintaining consistent optical characteristics, thereby improving operational stability and performance.
Implementation Method 1
a thermoelectric cooler (TEC) fixed to the second face of the housing; an optical circuit element fixed to the TEC
Implementation Method 2
a first block fixed to the first face of the housing by a first adhesive; an integrated circuit (IC) fixed to the first block
Implementation Method 3
a first adhesive; a second adhesive having a thickness larger than a thickness of the first adhesive; curing the second adhesive and the third adhesive for bonding the chip module to the first block and the TEC
Data Source
AI summary
An optical module includes: a housing having a first face and a second face parallel to the first face; a first block fixed to the first face of the housing by a first adhesive; an integrated circuit (IC) fixed to the first block by a second adhesive having a thickness larger than a thickness of the first adhesive; a thermoelectric cooler (TEC) fixed to the second face of the housing; an optical circuit element fixed to the TEC; and an interconnection board mounted on the IC and the optical circuit element, the interconnection board being configured to electrically couple the IC to the optical circuit element. The first block is sandwiched between the housing and the IC. The TEC is sandwiched between the housing and the optical circuit element.