Optical Module TEC Pillar Current Supply
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Solution Overview
Problem
Existing transmitter optical modules face challenges in securely supplying large currents to thermo-electric controllers (TEC) within the housing, often requiring thick wires or wide interconnections which can lead to inefficiencies and reliability issues.
Innovation Solution
The use of a multi-layered ceramic housing with electrical pads that directly connect to the TEC via pillars using solder, eliminating the need for bonding wires and enhancing current delivery while minimizing space and resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick wires or wide interconnections are used to supply large current to TEC, then current supply reliability is improved, but device complexity and space occupation increase
Solution Approach 1:
The patent transitions from planar wire connections to three-dimensional pillar structures that extend vertically through the ceramic substrate layers. This dimensional change allows current paths to be stacked in multiple layers, achieving high current capacity without requiring large lateral wire cross-sections, thus reducing space occupation while maintaining reliability
Solution Approach 2:
The patent merges the functions of current supply and structural support by integrating the pillar structures into the ceramic substrate itself. The pillars are formed as integral parts of the multi-layered ceramic assembly, combining electrical interconnection with mechanical support functions, thereby reducing overall device complexity while ensuring reliable current delivery
2Reliability
If thick wires or wide interconnections are used to supply large current to TEC, then current supply reliability is improved, but the area occupied by wiring increases
Solution Approach 1:
The patent utilizes vertical stacking of conductive pillars through multiple ceramic layers to achieve high current capacity in the vertical dimension rather than expanding wire cross-sections in the horizontal plane. This allows the wiring area to remain compact while still supplying several amperes of current reliably through the stacked pillar structures
Solution Approach 2:
The patent employs multi-layered ceramic composite structures with embedded conductive pillars and solder connections. This composite architecture distributes current paths across multiple material layers, achieving high current capacity without requiring large single-wire cross-sections, thus minimizing the overall wiring area while maintaining reliability
3Ease of manufacture
If bonding wires are used to connect TEC to electrical pad, then manufacturing flexibility is maintained, but current supply efficiency and connection lifespan decrease
Solution Approach 1:
The patent extracts and eliminates the bonding wire component from the electrical connection system. By directly forming conductive pillars within the ceramic substrate that extend to the electrical pads, the design removes the intermediate bonding wire layer, thereby reducing resistance and voltage drop while maintaining manufacturing feasibility through integrated pillar formation processes
Solution Approach 2:
The patent introduces conductive pillars as intermediary structures between the TEC and electrical pads. These pillars serve as robust mediating conductors that provide low-resistance current paths, replacing the high-resistance bonding wires. The pillars are integrated into the ceramic substrate and connected via solder, forming a reliable intermediate connection that minimizes energy loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for reliable and efficient supply of high currents to the TEC, reducing voltage drops and extending the lifespan of connections, while also enabling a more compact design suitable for high-frequency applications.
Implementation Method 1
the TEC provides a pillar facing the electrical pad of the ceramic layer, and being directly connected to the pad by, for instance, a solder without using any bonding wires
Data Source
AI summary
An optical transmitter module installing a thermo-electric controller (TEC) is disclosed. The optical module has a rectangular box portion as a package made of a multi-layered ceramics, within which the TEC is installed. The TEC has electrodes through which a current to driver the TEC electrically is provided. The module has a feature that the electrodes of the TEC is directly in contact with a pad provided in the back surface of the multi-layered ceramic housing.