Optical Module Thermal Buffer Using Phase-Change Heat Control
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Solution Overview
Problem
In optical modules, maintaining the temperature of optical semiconductor elements within a predetermined range while minimizing power consumption is challenging due to the inefficiencies in existing heat management systems.
Innovation Solution
The optical module incorporates a temperature buffer member made of phase transformation materials, such as silver sulfide or copper gallium telluride, which changes thermal conductivity at a specific temperature, paired with a heat dissipation member and a heater member to regulate the temperature of the optical semiconductor element, allowing for efficient heat dissipation and adjustment with low power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat management systems are used to maintain temperature of optical semiconductor elements, then temperature control is achieved, but power consumption increases due to system inefficiencies
Solution Approach 1:
The patent employs a phase change material (PCM) as the temperature buffer member that undergoes phase transition at a specific temperature range. When the optical semiconductor element generates heat and its temperature rises, the PCM absorbs the excess heat through phase transition (e.g., solid to liquid), maintaining the element's temperature within the predetermined range without requiring continuous active cooling, thus significantly reducing power consumption.
Solution Approach 2:
The temperature buffer member acts as an intermediary between the optical semiconductor element and the external environment. It mediates heat transfer by absorbing heat when the element temperature exceeds the predetermined range and releasing heat when it drops below, thereby stabilizing temperature without direct active control, reducing the need for high-power cooling systems.
2Temperature
If active heating and cooling systems are implemented to precisely control temperature, then temperature stability is improved, but device complexity increases
Solution Approach 1:
The temperature buffer member provides self-regulating temperature control without requiring complex external control systems. The PCM automatically absorbs or releases heat based on the temperature conditions, creating a passive yet effective temperature stabilization mechanism that simplifies the overall system architecture while maintaining temperature stability.
3Device complexity
If conventional thermal management is used without phase transformation materials, then system simplicity is maintained, but heat dissipation efficiency decreases
Solution Approach 1:
The phase change material enables highly efficient heat absorption during phase transition, capturing large amounts of heat energy that would otherwise be lost or require active cooling to manage. This passive heat dissipation mechanism significantly improves energy efficiency while adding minimal complexity to the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively maintains the optical semiconductor element's temperature within a predetermined range, reducing power consumption and stabilizing the module's operation by optimizing heat dissipation and management, thus addressing the inefficiencies of previous systems.
Implementation Method 1
The temperature buffer member is formed of a phase transformation material, a thermal conductivity of the phase transformation material changing at a phase transformation temperature
Implementation Method 2
an optical semiconductor element that is connected to the first surface and that generates heat by itself
Implementation Method 3
a heat dissipation member connected to the second surface
Data Source
AI summary
An optical module includes a temperature buffer member having a first surface and a second surface opposite to the first surface; an optical semiconductor element that is connected to the first surface and that generates heat by itself; and a heat dissipation member connected to the second surface. The temperature buffer member is formed of a phase transformation material, a thermal conductivity of the phase transformation material changing at a phase transformation temperature.