Optical Module Thermal Decoupling for Laser Diode Cooling
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Solution Overview
Problem
Existing parallel optical communications modules face challenges in efficient heat dissipation, leading to increased size and cost of heat dissipation devices, which limits the operating temperature of laser diodes and affects data rate performance.
Innovation Solution
A heat dissipation system that thermally decouples the heat dissipation paths for laser diodes and ICs, using separate heat dissipation devices for each, allowing the laser diodes to operate at lower temperatures while ICs can run hotter, thereby increasing data rates without enlarging the heat dissipation device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the size of the heat dissipation device is increased to dissipate more heat, then the heat dissipation capacity is improved, but the module size and cost increase
Solution Approach 1:
The patent divides the heat dissipation system into two separate heat dissipation devices: one for laser diodes and one for ICs. This segmentation allows each device to be optimized for its specific heat load, preventing the need for a single oversized heat dissipation device. The laser diode heat dissipation device can be smaller since it only needs to handle laser diode heat, while the IC heat dissipation device handles IC heat separately.
Solution Approach 2:
The patent applies different heat dissipation solutions to different components based on their specific thermal requirements. The laser diodes have a dedicated heat dissipation device with direct thermal coupling, while ICs have a separate heat dissipation device. This localized approach allows each component to operate at its optimal temperature without being constrained by a unified heat dissipation system.
2Speed
If the operating temperature of laser diodes is lowered to increase data rate, then the data rate is improved, but the heat dissipation device size must increase
Solution Approach 1:
By segmenting the heat dissipation system into separate devices for laser diodes and ICs, the patent enables the laser diode heat dissipation device to be sized appropriately for its specific heat load. This allows laser diodes to operate at lower temperatures for higher data rates without requiring an oversized heat dissipation device that would be needed if all heat were dissipated through a single device.
Solution Approach 2:
The patent changes the thermal parameters of the system by providing direct thermal coupling between the laser diodes and their dedicated heat dissipation device. This improves heat transfer efficiency from the laser diodes, enabling them to operate at lower temperatures and higher data rates without increasing the overall module size.
3Device complexity
If a single heat dissipation device is used for both laser diodes and ICs, then the device complexity is reduced, but the heat dissipation efficiency decreases
Solution Approach 1:
The patent segments the heat dissipation system into separate devices for laser diodes and ICs, improving heat dissipation efficiency by dedicating each device to specific heat loads. This segmentation allows for optimized thermal coupling and heat transfer paths for each component type, preventing heat interference between laser diodes and ICs.
Solution Approach 2:
The patent provides localized heat dissipation solutions with direct thermal coupling between laser diodes and their dedicated heat dissipation device. This local quality approach ensures efficient heat removal from laser diodes without being compromised by the thermal requirements of ICs, maintaining high heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables higher data rates for laser diodes while maintaining efficient heat dissipation, doubling the temperature differential and allowing the heat dissipation device to absorb twice as much heat without size increase, thus improving module performance and reducing costs.
Implementation Method 1
a first heat dissipation device mechanically coupled to the rear housing portion and thermally coupled to the heat dissipation interface. At least a portion of heat generated by the first IC is thermally coupled into the first heat dissipation device via the thermal coupling between the first heat dissipation device and the heat dissipation interface
Implementation Method 2
a second heat dissipation device mechanically coupled to the front housing portion and thermally coupled to at least the first array of laser diodes. A portion of heat generated by the laser diodes is thermally coupled into the second heat dissipation device via the thermal coupling between the second heat dissipation device and the first array of laser diodes
Data Source
AI summary
A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.