Optical Transmission Module With Thermal Isolation for Stable Cooling

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Solution Overview

Problem

Existing optical transmission modules face inefficiencies in temperature control of optical elements due to heat flow from the metal stem into the carrier, which can hinder the effectiveness of temperature control elements like Peltier elements.

Innovation Solution

The optical transmission module incorporates a metal stem with a signal terminal and support portion, a dielectric block with semiconductor and heat conduction surfaces, a temperature control element between the stem and heat conduction surface, and a heat insulation spacer with lower thermal conductivity than the support portion and relay board, which reduces heat inflow to the relay board and enhances temperature control of the optical element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the relay board is directly connected to the metal stem for electrical connection, then electrical connectivity is improved, but heat flows from the stem into the carrier and relay board, worsening temperature control of the optical element

Engineering Contradiction:
Improveelectrical connectivityVSAvoidtemperature control of optical element
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent introduces a heat insulation spacer as an intermediary component between the metal stem and the relay board. This spacer provides electrical insulation while allowing thermal isolation, thereby preventing heat flow from the stem to the relay board and carrier, and enabling effective temperature control of the optical element through the temperature control element.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat insulation measures are added to reduce heat flow, then temperature control is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature control of optical elementVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat insulation spacer serves multiple functions simultaneously: it provides electrical insulation between the metal stem and relay board, acts as a thermal barrier to prevent heat flow, and maintains the structural positioning of components. This multi-functionality achieves effective temperature control without significantly increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for efficient temperature control of optical elements by minimizing heat inflow, thereby reducing power consumption required for temperature control and improving the stability of optical signals.

Implementation Method 1

a heat insulation spacer having an insulation property and connected between the support portion and the relay board. The thermal conductivity of the heat insulation spacer is lower than the thermal conductivity of the support portion and lower than the thermal conductivity of the relay board.

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

A Peltier element as a cooling element is mounted on the stem

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS20240267125A1Optical transmission module
Publication Date: 2024.08.08 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US20240267125A1 patent drawing
  • US20240267125A1 patent drawing
  • US20240267125A1 patent drawing

AI summary

An optical transmission module according to one embodiment includes: a metal stem having a signal terminal extending in a first direction and a support portion extending in the first direction; a dielectric block containing a dielectric material and having a semiconductor mounting surface and a heat conduction surface; an optical semiconductor element mounted on the semiconductor mounting surface; a temperature control element disposed between the metal stem and the heat conduction surface; a relay board for electrically connecting the signal terminal to the optical semiconductor element; and a heat insulation spacer having an insulation property and connected between the support portion and the relay board. Thermal conductivity of the heat insulation spacer is lower than the thermal conductivity of the support portion and lower than the thermal conductivity of the relay board.