Optical Module Heat Dissipation via Multi-Layered Thermal Path
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Solution Overview
Problem
Optical modules in optical communication systems face performance deterioration due to inadequate heat dissipation, as components like lasers and detectors generate heat that cannot be quickly dissipated, leading to rising environmental temperatures.
Innovation Solution
The optical module incorporates a multi-layered heat dissipation structure comprising first, second, and third heat dissipation members, along with thermally conductive materials and members, to effectively conduct heat generated by optical chips away from the lens assembly and dissipate it through the upper and lower enclosures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat dissipation members are added to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat dissipation structure is divided into multiple independent members: first heat dissipation member attached to optical chip, second heat dissipation member for lateral heat diffusion, third heat dissipation member embedded in circuit board, and thermally conductive member for vertical heat transfer. Each segment performs a specific heat dissipation function, allowing the system to achieve efficient heat management through coordinated action of simplified individual components.
Solution Approach 2:
The patent implements heat dissipation in multiple spatial dimensions: the first heat dissipation member handles vertical heat conduction from the chip, the second heat dissipation member diffuses heat laterally across the circuit board plane, the third heat dissipation member provides embedded heat sinking, and the thermally conductive member transfers heat to the upper enclosure. This multi-dimensional approach maximizes heat dissipation efficiency while keeping each individual component relatively simple.
2Reliability
If heat dissipation structure is added to maintain optimal temperature, then reliability is improved, but device complexity increases
Solution Approach 1:
The heat dissipation members are integrated with existing structural components of the optical module. The first heat dissipation member is attached to the optical chip mounting area, the second heat dissipation member is incorporated into the circuit board structure, and the thermally conductive member connects to the upper enclosure. By merging heat dissipation functions with existing structural elements, the patent improves reliability without adding completely separate complex subsystems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This heat dissipation structure efficiently manages heat generated by optical components, preventing performance degradation and ensuring reliable operation by maintaining optimal temperatures within the optical module.
Implementation Method 1
the first heat dissipation member is configured to conduct heat generated by the optical chip to outside of a coverage region of the lens assembly
Implementation Method 2
the second heat dissipation member is provided outside of the lens assembly, and is configured to receive and diffuse heat conducted by the first heat dissipation member
Implementation Method 3
a through hole provided between the first heat dissipation member and the third heat dissipation member, penetrating a multilayer plate in the circuit board, filled with a thermally conductive material, and configured to perform heat conduction between the first heat dissipation member and the third heat dissipation member
Implementation Method 4
a thermally conductive member disposed on an upper surface of the second heat dissipation member and configured to receive heat conducted by the second heat dissipation member, wherein one end of the thermally conductive member is thermally coupled to the upper enclosure for conducting the heat to the upper enclosure
Data Source
AI summary
This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.