Optical Transmission Module Thermal Management via Segmented Housing

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Solution Overview

Problem

Optical transmission modules face issues with heat-induced deformation and deterioration of optical coupling efficiency due to inadequate heat radiation properties in existing configurations, where the optical connector is directly affected by heat from the drive circuit or optical element.

Innovation Solution

An optical transmission module design featuring a main substrate with a first special region to prevent heat transfer from the heat source element and a second special region to facilitate heat transfer, using a transparent substrate and wirings to manage heat generated by the heat source element and optical element, thereby suppressing thermal deformation and maintaining optical coupling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the optical connector is directly fixed to the housing containing the heat source, then the device structure is simplified, but the optical coupling efficiency deteriorates due to thermal deformation

Engineering Contradiction:
Improvedevice structureVSAvoidoptical coupling efficiency
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The housing is divided into a heat radiation housing and a connector housing, which are separately formed and then assembled together. This segmentation allows the heat radiation housing to be optimized for thermal management while the connector housing maintains optical precision, resolving the contradiction between structural simplicity and optical coupling efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heat radiation plate is introduced as an intermediary component between the heat source and the connector. This plate serves as a thermal conduit that directs heat away from the connector region, enabling the connector to remain thermally isolated while maintaining structural integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the heat source element is not in contact with the main substrate, then heat radiation is improved according to prior art, but the heat radiation property becomes extremely low

Engineering Contradiction:
Improveheat radiationVSAvoidheat radiation property
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heat radiation plate acts as an intermediary that enables effective thermal contact between the heat source element and the heat radiation housing. This plate provides a dedicated thermal pathway that ensures efficient heat transfer from the heat source to the housing, resolving the contradiction between thermal isolation and heat radiation efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The housing is designed with different thermal properties in different regions: the heat radiation housing has high thermal conductivity to efficiently radiate heat, while the connector housing maintains thermal isolation. This local differentiation of thermal properties allows simultaneous optimization of heat radiation and optical coupling.

Inventive Principle:
Principle #3Local quality

3Power

If the optical element and drive circuit generate heat, then the device can function properly, but the heat causes thermal deformation and deteriorates optical coupling efficiency

Engineering Contradiction:
Improvedevice functionVSAvoidoptical coupling efficiency
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The housing is segmented into distinct thermal zones: a heat radiation housing that contains and manages heat from the optical element and drive circuit, and a connector housing that remains thermally isolated. This segmentation allows the device to maintain full functionality while protecting the optical coupling interface from thermal deformation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat management function is extracted and isolated into a separate heat radiation housing, while the optical coupling function is maintained in a thermally isolated connector housing. This extraction allows each component to be optimized for its specific function without interference from thermal effects.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module effectively suppresses heat-induced deformation and maintains optical coupling efficiency by strategically managing heat transfer, ensuring reliable operation with improved thermal management.

Implementation Method 1

one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first special region provided between the connector substrate and the first transparent substrate to prevent the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11719896B2Optical transmission module
Publication Date: 2023.08.08 SONY GROUP CORP
  • US11719896B2 patent drawing
  • US11719896B2 patent drawing
  • US11719896B2 patent drawing

AI summary

An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.