Optical Module Thermal Support Structure for Stable Emission
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Solution Overview
Problem
Existing optical modules face challenges in maintaining the operating temperature of light emission components within a stable range, particularly for high-frequency performance, due to sensitivity to environmental temperature variations.
Innovation Solution
Incorporation of a support component with high thermal conductivity and a temperature regulating mechanism, such as a heating element or Thermoelectric Cooler (TEC), to stabilize the operating temperature of light emission components within a predetermined range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a temperature regulating mechanism is added to stabilize the operating temperature of light emission components, then the high-frequency performance and reliability are improved, but the device complexity increases
Solution Approach 1:
The support component integrates multiple functions: it provides mechanical support for the optical chip, serves as a heat dissipation path due to its higher thermal conductivity coefficient compared to the circuit board, and works with the temperature regulating mechanism to stabilize operating temperature. This merging of support and thermal management functions into a single component reduces overall device complexity while maintaining reliability.
Solution Approach 2:
The support component acts as an intermediary between the optical chip and the circuit board, providing a dedicated thermal management path. By positioning the temperature regulating mechanism below the lens component and connecting it to the support component, the system creates an efficient thermal management pathway that stabilizes the optical chip temperature without requiring direct integration with the circuit board, thus reducing complexity.
2Temperature
If the thermal conductivity coefficient of the support component is increased to improve heat dissipation, then the temperature stability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The support component is designed with differentiated thermal properties - it has a higher thermal conductivity coefficient than the circuit board specifically in the regions contacting the optical chip to enhance heat dissipation where needed. This localized quality enhancement provides temperature stability without requiring the entire assembly to meet uniformly high manufacturing precision standards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the operating temperature of light emission components, ensuring high-frequency performance and reducing the impact of environmental temperature fluctuations.
Implementation Method 1
The thermal conductivity coefficient of the support component is greater than or equal to that of the circuit board
Implementation Method 2
The temperature regulating mechanism is located below or beside the light emission component, configured for regulating the operating temperature of the light emission component
Implementation Method 3
The lens component is connected to the circuit board at its bottom and is covered over the light emission component, configured for changing a transmission direction of the optical signal generated by the light emission component
Data Source
AI summary
An optical module provided in the present disclosure includes: a circuit board provided with a through-hole; a light emission component configured for generating an optical signal; a driver located beside the light emission component and electrically connected to the light emission component; a lens component connected to the circuit board at its bottom and is covered over the light emission component, configured for changing a transmission direction of the optical signal generated by the light emission component; a support component, which has a top located inside the through-hole and is connected to the circuit board; a temperature regulating mechanism located below the lens assembly and connected to the support component at its bottom; wherein the temperature regulating mechanism is located below or beside the light emission component, configured for regulating an operating temperature of the light emission component.