Optical Module Ground Through-Hole Layout for Frequency Response
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Solution Overview
Problem
Existing optical modules face challenges in efficiently transmitting high-speed electrical signals due to parasitic inductance and capacitance, which affect frequency response characteristics and mechanical stability, particularly in optical transmission devices.
Innovation Solution
The optical module incorporates a metal stein with signal and ground pins, a flexible printed circuit (FPC) with specific through-holes and junction parts, and a ground layer configuration that reduces parasitic inductance and capacitance by positioning the junction parts closer to the signal pins, enhancing ground reinforcement and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the ground pin is positioned farther from the signal pin, then the mechanical stability is improved, but the parasitic inductance increases and frequency response characteristics deteriorate
Solution Approach 1:
The patent applies local quality by creating different spatial relationships for different functional elements. The ground pin is positioned at a first distance from the signal pin, while the assistance through-hole is positioned at a second distance that is shorter than the first distance. This localized optimization of hole positioning around specific pins improves frequency response characteristics in critical areas without compromising overall mechanical stability.
2Strength
If the junction part is positioned farther from the signal pin, then the mechanical strength is improved, but the parasitic inductance increases and frequency response characteristics deteriorate
Solution Approach 1:
The patent creates a localized reinforcement zone by positioning the assistance through-hole closer to the signal through-hole than the ground pin is to the signal pin. The junction part connects this assistance through-hole to the ground layer, forming a compact ground reinforcement structure around the signal path that reduces parasitic inductance while maintaining mechanical strength through the overall stein structure.
Data Source
AI summary
An optical module includes an optical semiconductor element a stem including a signal pin and a ground pin; and a circuit board, the circuit board including a signal through-hole, a ground through-hole, a ground layer, and a junction part, the signal through-hole being configured to be pierced by the signal pin, the ground through-hole being configured to be pierced by the ground pin, the signal line being configured to be electrically connected with the signal pin, the ground layer being configured to be electrically connected with the ground pin, the junction part being configured to connect the assistance through-hole and the ground layer around the assistance through-hole with the stem. The circuit board has a first distance between the assistance through-hole and the signal through-hole, the first distance being smaller than a second distance between the ground through-hole and the signal through-hole.