Optical Module Heat Sink with Lifted TIM Contact for OIR
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of preventing thermal interface material (TIM) damage during the online insertion and removal (OIR) of high-power optical modules, such as QSFP-DD, due to surface irregularities and air gaps leading to reduced heat transfer efficiency and potential electrical connection issues.
Innovation Solution
The use of lifting elements, such as wedges, balls, or plungers, to lift the heat sink during OIR, creating a gap between the TIM and the optical module, which snap into corresponding recesses upon full insertion to ensure direct contact without user intervention, thereby minimizing sliding contact and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal interface material (TIM) is introduced between the heat sink and optical module to improve heat transfer, then heat transfer efficiency is improved, but the TIM is damaged during module online insertion and removal (OIR)
Solution Approach 1:
Lifting elements are positioned in advance on the heat sink to engage with corresponding features on the optical module housing before the module is fully inserted. These elements preliminarily lift the heat sink away from the TIM, preventing contact and damage during the insertion process, while still allowing the module to be securely retained in the cage.
Solution Approach 2:
The lifting elements act as intermediary components between the heat sink and the optical module. They mediate the interaction by providing a mechanical lifting action that separates the heat sink from the TIM during OIR operations, thereby protecting the TIM from damage while maintaining the thermal interface when needed.
2Loss of energy
If the heat sink is kept in direct contact with the optical module to ensure thermal coupling, then heat transfer is maximized, but the TIM and electrical connections are damaged during insertion or removal
Solution Approach 1:
The heat sink is designed with dynamic lifting capability through the lifting elements, allowing it to change position relative to the optical module. During normal operation, the heat sink maintains thermal contact for efficient heat transfer. During OIR operations, the lifting elements dynamically lift the heat sink to prevent mechanical damage, enabling the system to adapt its configuration based on operational needs.
Solution Approach 2:
The lifting elements provide preliminary anti-action by preemptively lifting the heat sink away from the TIM before any damaging contact can occur during insertion or removal. This preventive measure counteracts the potential harmful mechanical forces that would otherwise damage the TIM and electrical connections.
3Strength
If lifting elements are added to prevent TIM damage during OIR, then TIM protection is improved, but device complexity increases
Solution Approach 1:
Rather than making the entire heat sink complex, lifting elements are added only at specific localized positions where they are needed to engage with the module housing. This localized approach provides the necessary protection functionality while minimizing the overall increase in device complexity.
Solution Approach 2:
The lifting elements serve multiple functions: they lift the heat sink during OIR to protect the TIM, and they also provide retention features to secure the module in the cage. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents TIM damage, enhances thermal management, and maintains optical module reliability by ensuring efficient heat transfer and electrical connectivity, compliant with multi-source agreement standards.
Implementation Method 1
The plurality of lifting elements are configured to create a gap between the thermal interface material and the heat sink during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage
Implementation Method 2
a thermal interface material attached to a surface of the optical module for thermal contact with the heat sink
Data Source
AI summary
In one embodiment, an apparatus includes an optical module, and a heat sink for attachment to an optical module cage configured for receiving the optical module, the heat sink having a surface in which recesses are formed. The optical module includes a thermal interface material attached to a surface of the optical module for thermal contact with the heat sink, and lifting elements extending from the surface. The lifting elements are configured to create a gap between the thermal interface material and the heat sink during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, and are positioned for insertion into aligned recesses in the heat sink when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the heat sink and the thermal interface material.