Optical Module Transparent Packaging Eliminates Vacuum Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical communication modules require expensive vacuum assembly to prevent moisture and dust erosion, which complicates the welding and alignment of optical fiber connectors, increasing manufacturing costs and complexity.
Innovation Solution
The use of transparent packaging materials, such as epoxy resin, to encase the optical communication module components, providing moisture and dust protection while eliminating the need for vacuum assembly, and an electromagnetic shielding layer to reduce interference, simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum assembly is used to seal components in a metal housing, then protection from moisture and dust is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the vacuum sealing requirement from the manufacturing process by using transparent packaging materials that provide moisture and dust protection without requiring vacuum assembly. This eliminates the need for expensive vacuum equipment and complex sealing procedures while maintaining component protection.
Solution Approach 2:
The patent employs cost-effective transparent packaging materials such as epoxy resin or glass that can be applied through simple pouring or injection processes. These materials provide adequate protection for the optical components without the need for expensive metal housings and vacuum sealing systems.
2Duration of action of stationary object
If vacuum environment is used to prevent deterioration, then service life is improved, but welding and alignment difficulty increases
Solution Approach 1:
The patent performs welding and alignment operations in normal atmospheric conditions before the transparent packaging material is applied. This preliminary action allows for easier manipulation and positioning of optical components without the constraints of a vacuum environment, while the subsequent packaging provides long-term protection to maintain service life.
Solution Approach 2:
The transparent packaging material acts as an intermediary that provides environmental protection without requiring a vacuum environment during assembly. This allows standard welding and alignment procedures to be performed in normal conditions, then seals the components to prevent deterioration over time.
3Reliability
If metal housing with vacuum sealing is used, then component protection is improved, but device complexity increases
Solution Approach 1:
The patent removes the complex vacuum sealing system and metal housing structure by using simple transparent packaging materials that can be applied through pouring or injection. This extraction of the vacuum requirement simplifies the overall device structure while maintaining adequate component protection.
Solution Approach 2:
The patent uses thin transparent packaging materials such as epoxy resin or glass that conform to the components and provide protection without requiring rigid metal housings. These flexible packaging solutions simplify the device structure and reduce assembly complexity compared to traditional vacuum-sealed metal enclosures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the service life and signal reliability of optical communication modules, reduces manufacturing costs, and simplifies the assembly process by protecting components from environmental factors without the need for vacuum sealing, while maintaining alignment and reducing electromagnetic interference.
Implementation Method 1
The optical communication module, the printed circuit board, and the electronic and optical components are sealed in a metal housing to keep the inside of the metal housing in a vacuum, thereby preventing the electronic and optical components from deteriorating due to the erosion of moisture and dust, etc.
Implementation Method 2
an electromagnetic shielding layer to reduce interference
Data Source
AI summary
An optical communication module made with transparent packaging material which locates elements and provides protection against contaminants and EMI includes a printed circuit board; a photoelectric element disposed on the printed circuit board; an optical-fiber connector disposed on the printed circuit board, corresponding to the photoelectric element; the transparent packaging material covers the printed circuit board, the photoelectric component and the optical-fiber connector. An electromagnetic shielding layer covers the transparent packaging material. A method of manufacturing same is also disclosed.