Optical Module With Turning Prism And Displacement Prism
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Solution Overview
Problem
Existing optical modules face challenges in efficiently converting optical signals to electrical signals and vice versa, particularly in high-speed and long-distance optical communication systems, due to complex optical paths and high optical power loss.
Innovation Solution
The optical module incorporates a circuit board, an optical waveguide substrate, a turning prism, an optical reception chip, a laser chip, a reflector, and a displacement prism, which work together to efficiently transmit optical reception and emission signals through optimized optical port arrangements and optical path configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional optical paths are used in optical modules, then the structure is simpler, but optical power loss increases and conversion efficiency decreases
Solution Approach 1:
The patent introduces a turning prism that redirects the optical path at an angle, transitioning from a planar arrangement to a three-dimensional configuration. This spatial reorganization allows the optical reception chip and laser chip to be positioned on opposite sides of the circuit board, reducing optical power loss by optimizing the optical path while managing the increased structural complexity through precise geometric design.
Solution Approach 2:
The turning prism acts as an intermediary optical element that mediates between the optical waveguide substrate and the optical reception chip. By introducing this intermediate component, the patent achieves better optical coupling and reduced power loss, accepting the trade-off of additional component complexity to improve overall system efficiency.
2Reliability
If optical chips are positioned on the same side of the circuit board, then the structure is more compact, but optical signal interference increases and conversion efficiency decreases
Solution Approach 1:
The patent segments the optical chip arrangement by positioning the optical reception chip and laser chip on opposite sides of the circuit board rather than clustering them together. This spatial segmentation eliminates optical signal interference between transmission and reception paths, improving conversion reliability while distributing the structural complexity across different locations.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional configuration by utilizing both sides of the circuit board. This vertical and spatial separation of optical chips prevents signal interference and improves conversion efficiency, managing the increased structural complexity through optimized spatial distribution rather than dense packing.
3Adaptability or versatility
If complex optical paths are used, then optical signal routing flexibility increases, but optical power loss increases and system reliability decreases
Solution Approach 1:
The patent applies local optimization by carefully designing the optical path configuration in critical areas where power loss occurs. The turning prism is strategically positioned to provide the necessary routing flexibility only where needed, rather than creating a uniformly complex path throughout the system. This localized approach maintains reliability by minimizing unnecessary optical path length while achieving the required routing adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces optical power loss and improves the efficiency of optical signal conversion, enabling high-speed and long-distance optical communication with lower costs and increased reliability.
Implementation Method 1
The turning prism is arranged at a side of the first output optical port and is configured to receive and reflect the optical reception signal
Implementation Method 2
The reflector is arranged in an output optical path of the laser chip and is configured to reflect the optical emission signal
Implementation Method 3
the displacement prism is configured to guide the optical emission signal output from the reflector to the second input optical port
Data Source
AI summary
An optical module including an optical waveguide substrate, a turning prism, an optical reception chip, a laser chip, a reflector and a displacement prism. The optical waveguide substrate is provided, at different sides thereof, with input optical ports and output optical ports to transmit optical reception and emission signals. The laser chip is arranged in a layer different from that of the optical waveguide substrate, so as to guide an optical emission signal from the laser chip into one input optical port. The reflector is arranged in an output optical path of the laser chip to reflect the optical emission signal from the laser chip. A light input end of the displacement prism faces the layer where the laser chip is located, a light output end thereof faces one input optical port to guide the optical emission signal reflected by the reflector into the optical waveguide substrate.