Optical Module Vertical Stacking for Miniaturization
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Solution Overview
Problem
Conventional optical modules face challenges in miniaturization due to the parallel arrangement of optical and control components, which requires significant space and hinders compact design.
Innovation Solution
The optical module design features a housing with a lid that hermetically seals the optical component, a printed circuit board on the lid's surface for the control circuit, and a flexible substrate for electrical connection between side electrodes and the control circuit, allowing for vertical stacking and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the optical component and control circuit are arranged in parallel, then the module structure is simple, but the module size becomes large and miniaturization becomes difficult
Solution Approach 1:
The patent transitions from a parallel (2D) arrangement to a stacked (3D) arrangement of components. The optical component is placed on the circuit board, and the resin case is stacked on top, utilizing the vertical dimension to reduce the horizontal footprint and achieve miniaturization while maintaining structural simplicity.
2Device complexity
If the optical component and control circuit are arranged in parallel, then the module structure is simple, but the distance between components increases leading to noise interference
Solution Approach 1:
By stacking the resin case containing the optical component vertically on the circuit board, the patent reduces the horizontal distance between the optical component and control circuit. This vertical arrangement minimizes electromagnetic interference and noise while keeping the overall structure simple.
3Reliability
If the optical component is sealed in a resin case, then the optical component is protected, but heat dissipation becomes difficult
Solution Approach 1:
The patent uses a resin case with a thin bottom wall that provides protection for the optical component while maintaining thermal conductivity. The thin bottom wall allows heat to dissipate effectively to the circuit board below, balancing protection and heat dissipation requirements.
4Adaptability or versatility
If the control circuit is mounted on a separate power board, then the circuit layout is flexible, but the module requires more space
Solution Approach 1:
The patent integrates the control circuit directly onto the same circuit board that supports the optical component, eliminating the need for a separate power board. This merging of functions reduces the overall module space while maintaining circuit layout flexibility through proper board design.
Data Source
AI summary
The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.