Optical Module Package Structure With Via-Reduced Signal Routing
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Solution Overview
Problem
The increasing density of components in optical modules leads to heat-dissipation and high-frequency performance issues due to complex traces and conductive vias, which degrade signal quality and lower performance.
Innovation Solution
An optical module package structure with a housing and circuit board, incorporating a sub-board that electrically connects devices to the circuit board, allowing heat dissipation through a main heat-dissipation surface and reducing the need for conductive vias, thereby improving heat-dissipation and high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If more components and high-speed signal lines are added to increase module density, then the channel capacity increases, but the trace complexity increases and requires more conductive vias which degrade signal quality
Solution Approach 1:
The patent introduces a sub-board dimension between the circuit board and the first housing, creating a new spatial layer for signal routing. High-speed signal lines are extended from the circuit board to the sub-board, allowing signals to bypass conductive vias and route through the sub-board's surface traces instead, thus maintaining signal quality while supporting higher channel capacity
Solution Approach 2:
The sub-board acts as an intermediary structure between the circuit board and the first housing. It receives extended high-speed signal lines from the circuit board and provides alternative routing paths on its surface, mediating the connection without requiring signals to pass through degrading conductive vias in the circuit board
2Temperature
If high-power consumption chips are placed on the side close to the main heat-dissipation surface, then power consumption is concentrated for better heat management, but the trace complexity increases significantly
Solution Approach 1:
The sub-board creates an additional dimensional space that allows power and ground traces to be routed on the sub-board surface rather than through the circuit board's internal layers. This separates high-power chip connections from the main circuit board trace network, reducing trace complexity while maintaining concentrated heat management on the main heat-dissipation surface
3Reliability
If the photoelectric chip's wire-bonding surface faces the main heat-dissipation surface for electrical connection, then electrical connection is achieved, but the heat sink must be placed between the chip and secondary heat-dissipation surface reducing heat-dissipation speed
Solution Approach 1:
The sub-board provides an extended routing dimension that allows high-speed signal lines to reach the photoelectric chip from the circuit board without requiring the chip to face the main heat-dissipation surface. The chip can be positioned with its wire-bonding surface facing the sub-board while still being electrically connected, and the heat sink can be optimally positioned for heat dissipation to the second housing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat-dissipation efficiency and reduces the influence of conductive vias on high-frequency signals, improving trace space and overall module performance.
Implementation Method 1
an outer surface of the first housing is a main heat-dissipation surface
Data Source
AI summary
An optical module package structure, comprising a housing, and a circuit board, a first device, and a sub-board that are packaged in the housing. The housing comprises a first housing and a second housing. An outer surface of the first housing is a main heat-dissipation surface. The first device is electrically connected to the circuit board by means of the sub-board. A first signal line is provided on the circuit board. An extension section is provided on the sub-board. The sub-board partially overlaps the circuit board, and is connected to same. The first signal line extends to the extension section. The surfaces of the sub-board and the circuit board which partially overlap each other face opposite directions. The first device is electrically connected to the extension section. The first device is provided with a heat-dissipation surface. The heat-dissipation surface faces the first housing, and is thermally connected to same.