Subminiature Optical Module Packaging for Precise Waveguide Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The assembly of optical transmission modules, particularly the alignment between edge-type light emitting elements and arrayed waveguide gratings, faces significant challenges due to height tolerance and misalignment issues, leading to increased assembly costs and complexity, especially in miniaturizing these components for high-speed optical communication systems.
Innovation Solution
The implementation of a Fan Out Wafer Level Packaging (FOWLP) scheme automates optical alignment in all x, y, and z directions between edge-type light emitting elements and optical components, integrating these elements into a system-in-package (SiP) format, using a semiconductor manufacturing process to minimize size and eliminate height tolerance caused by inter-element wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional assembly methods are used for aligning edge-type light emitting elements and optical components, then assembly flexibility is maintained, but manufacturing precision deteriorates due to height tolerance and misalignment issues
Solution Approach 1:
The patent merges the light emitting element and optical component into a single integrated optical module where the optical component is directly mounted on the light emitting element substrate. This integration eliminates the need for separate alignment procedures and reduces height tolerance issues by removing intermediate mounting structures, thereby improving manufacturing precision while reducing assembly complexity.
Solution Approach 2:
The patent implements preliminary alignment features during the manufacturing process, including pre-positioned mounting structures and standardized interface geometries that ensure correct alignment before final assembly. This preliminary action approach allows automated assembly equipment to achieve precise alignment without complex real-time adjustment mechanisms, improving both precision and reducing assembly complexity.
2Productivity
If automated assembly is implemented for optical alignment, then productivity is improved, but manufacturing precision deteriorates due to tolerance accumulation in automated processes
Solution Approach 1:
The patent changes the dimensional parameters of the optical components and mounting structures to accommodate automated assembly tolerances. This includes designing larger tolerance zones in non-critical dimensions, optimizing the size of alignment features, and selecting materials with appropriate thermal expansion characteristics that maintain alignment accuracy despite variations in automated assembly processes, thereby achieving both high productivity and manufacturing precision.
3Volume of moving object
If miniaturization is pursued for optical transmission modules, then volume is reduced, but ease of manufacture deteriorates due to increased difficulty in alignment and assembly
Solution Approach 1:
The patent applies a nested structure where the optical component is embedded within or directly integrated with the light emitting element housing, and electrical connections are made through integrated contact structures rather than separate wiring. This nesting approach minimizes the overall module volume while maintaining ease of manufacture by reducing the number of discrete parts and assembly steps required.
Solution Approach 2:
The patent combines multiple functions into single integrated structures, such as integrating the optical component mounting structure with the electrical connection substrate, and combining mechanical support and optical alignment functions into unified features. This merging reduces the number of separate components that need to be manufactured and assembled, thereby easing manufacturing while achieving miniaturization.
Data Source
AI summary
Provided are an optical transmission module including: a mold body having a first surface and a second surface opposite to the first surface; edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in an edge direction of a chip; and an optical component disposed on one side of the edge-type light emitting elements and molded inside the mold body, the optical component includes, on one side thereof, a plurality of input waveguides corresponding to the edge-type light emitting elements, and optically processes or transmits the plurality of optical signals incident through the plurality of input waveguides, and an optical axis of each of the light emitting elements and an optical axis of each of the input waveguides of the optical component is optically aligned.