Optical Module Wiring Pattern for TEC Power Supply
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Solution Overview
Problem
Optical modules with built-in semiconductor laser elements face challenges in precisely controlling laser beam wavelengths, leading to potential failures due to long bonding wires connecting TECs, which can cause short circuits and affect temperature control reliability.
Innovation Solution
The optical module design includes a housing with a specific configuration where the second TEC is disposed between the first TEC and the second end wall, with a wiring pattern arranged side by side with the heat transfer part to supply power, reducing the module's size and improving reliability by avoiding long bonding wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If long bonding wires are used to connect TECs to external terminals, then electrical connection is achieved, but the risk of short circuits increases and reliability deteriorates
Solution Approach 1:
The patent introduces an intermediary wiring pattern formed on the housing inner wall that acts as a mediator between the external terminal and the TEC. This wiring pattern is integrated into the housing structure itself, providing a protected electrical connection path that eliminates the need for long external bonding wires, thereby reducing short circuit risk while maintaining electrical connectivity.
Solution Approach 2:
The patent replaces the traditional mechanical bonding wire connection with an integrated wiring pattern structure formed directly on the housing. This substitution eliminates the mechanical vulnerability of long bonding wires by incorporating the electrical connection path into the housing's structural framework, providing both electrical connectivity and mechanical protection.
2Reliability
If TECs are positioned far from external terminals, then temperature control function is achieved, but wiring complexity and module size increase
Solution Approach 1:
The patent merges the wiring function with the housing structure by forming the wiring pattern directly on the housing inner wall. This integration combines the structural support function of the housing with the electrical connection function, eliminating separate wiring components and simplifying the overall device architecture while maintaining the necessary electrical connections for TEC operation.
Solution Approach 2:
The housing structure serves multiple functions: it provides mechanical support, thermal management, and electrical connection pathways. The wiring pattern formed on the housing inner wall demonstrates multi-functionality by simultaneously serving as both a structural element and an electrical conductor, thereby reducing the number of separate components needed in the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient power supply to the first TEC, reduces the risk of short circuits, and enhances the module's reliability by maintaining consistent temperature control, contributing to a more compact and reliable optical module.
Implementation Method 1
a heat transfer part configured to transfer heat between the first substrate and the second substrate
Implementation Method 2
a first temperature control device equipped with the semiconductor laser element and configured to control a temperature of the semiconductor laser element
Data Source
AI summary
The optical module includes: a housing having first and second end walls and a pair of side walls; a semiconductor laser element; a first TEC; a wavelength locker unit including an optical splitting component and an etalon filter; and a second TEC. The second end wall is provided with a feedthrough. The pair of side walls is not provided with an external connection terminal. The second TEC is disposed between the first TEC and the second end wall and has: a first substrate thermally coupled to a bottom surface of the housing; a second substrate thermally coupled to the etalon filter; and a heat transfer part that transfers heat. The optical module further includes a wiring pattern that is arranged side by side with the heat transfer part and that supplies electric power to the first TEC from the feedthrough.