Optical Module Wiring Sub-Mount Height Offset
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Solution Overview
Problem
Current optical modules, particularly those for digital coherent communication, face challenges in size reduction due to the inclusion of large termination boards and other high-frequency optical elements, which hinder the miniaturization of modules like the CFP2 standard for middle-distance optical communication.
Innovation Solution
The implementation of a wiring sub-mount that leads wiring to a height different from the optical element's mounting surface, allowing the circuit board, including the termination board, to be arranged at a varying height, thereby enhancing the degree of freedom in arrangement and reducing the overall size of the optical module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a termination board is incorporated into the optical module to support high-frequency optical elements, then the electrical connection and signal integrity are improved, but the module size increases due to the additional board and electronic components
Solution Approach 1:
The patent merges the termination board function with the optical element mounting substrate by integrating the electrical connection structure directly into the optical element package. The wiring board serves dual purposes: mounting the optical element and providing termination functions, eliminating the need for a separate termination board and reducing overall module size while maintaining electrical connection reliability
Solution Approach 2:
The patent implements a nested structure where the wiring board is positioned beneath the optical element, with the optical element package containing the wiring board. This nested arrangement allows the termination function to be embedded within the optical element structure itself, achieving space-efficient integration that reduces module footprint while preserving electrical connection integrity
2Ease of manufacture
If the circuit board is arranged on the same plane as the optical element, then the connection is simplified, but the module size increases due to insufficient space utilization
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. The circuit board is positioned at a different height level (above or below) the optical element rather than on the same plane, utilizing the vertical dimension for space utilization. This dimensional change maintains connection simplicity through direct vertical coupling while dramatically reducing the horizontal footprint of the module
Data Source
AI summary
An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.