Optical Communication Modules for High-Density Chip I/O
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Solution Overview
Problem
The increasing input/output capacities of electronic processing chips are not adequately served by electrical signals within the limited size of a practically viable electronic chip package, necessitating a more efficient data transmission solution.
Innovation Solution
A data processing system incorporating optical communication modules with a two-dimensional arrangement of electrical contacts and optical fiber connectors, allowing for removably coupled optical modules that convert between optical and electrical signals, and a grid structure for efficient orientation and mounting of these modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical signals are used for data transmission within electronic chip packages, then the system structure remains simple, but the input/output capacity is insufficient for high-performance electronic processing chips
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission using optical fibers. Optical modules convert electrical signals to optical signals for transmission through optical fibers, then back to electrical signals. This substitution enables significantly higher input/output capacity (e.g., 100Gbps, 400Gbps, or higher) compared to traditional electrical connections, while the modular optical interface keeps the overall system structure manageable.
Solution Approach 2:
The patent introduces a new dimension of optical transmission alongside the traditional electrical transmission plane. By adding optical fibers that run parallel to or alongside electrical connections, the system achieves higher bandwidth without fundamentally redesigning the entire electrical interconnect architecture. The optical modules interface with existing electrical buses while providing enhanced transmission capacity.
2Productivity
If optical fibers are used to transmit optical signals between data processing servers, then the data transmission capacity increases, but the conversion between optical and electrical signals increases device complexity
Solution Approach 1:
The patent merges the optical transmission function with the existing electrical interface structure. Optical modules are designed to integrate multiple functions: optical-to-electrical conversion, electrical-to-optical conversion, signal processing, and physical interfacing. This consolidation reduces the number of separate components and simplifies the overall system architecture despite the added optical transmission capability.
Solution Approach 2:
The optical modules are designed as universal interfaces that can handle multiple data rates (e.g., 25Gbps, 50Gbps, 100Gbps, 400Gbps) and support various form factors. The same basic module architecture can be configured for different transmission capacities by changing the optical fiber count or configuration, reducing the need for multiple specialized components.
3Productivity
If the number of electrical contacts is increased to serve higher input/output capacities, then the data transmission capacity improves, but the chip package size must increase
Solution Approach 1:
The patent replaces the need for numerous electrical contacts with optical fiber connections. Optical fibers have significantly higher bandwidth capacity than electrical traces, allowing the same or higher input/output capacity to be achieved with fewer physical connections. This reduces the area required on the chip package for connectors and trace routing.
Solution Approach 2:
The patent moves the high-capacity transmission medium from the planar electrical trace layer to the three-dimensional space of optical fibers. Optical fibers can be routed through vertical channels, side-mounted connectors, or integrated within the package structure in ways that utilize vertical space rather than only horizontal plane area, effectively increasing capacity without proportionally increasing package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances data transmission capacity and flexibility with higher input/output per unit area, achieving high power efficiency and low construction and operation costs while enabling reconfigurable optical network connections.
Implementation Method 1
Each data processing server receives first optical signals from optical fiber cables, converts the first optical signals to first electrical signals
Implementation Method 2
use optical fibers to transmit optical signals between the data processing servers
Data Source
AI summary
An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.