Co-Packaged Optical Modules for Low-Loss Switch Substrates
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Solution Overview
Problem
Existing optical transceiver designs face challenges in integrating components within smaller footprints due to side-by-side placement consuming board area and introducing electrical loss through wire bonds, which are impractical for high-frequency signal transmission.
Innovation Solution
A co-packaged optical module with dual fiber coupling strategies and a method for assembling multiple optical modules on a single silicon photonics substrate, utilizing vertical coupling for power and edge coupling for signals, along with a data processor, to form a high-speed electro-optical switch module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are placed side-by-side on the substrate, then the optical transceiver can be assembled with all critical components, but the board area consumption increases and electrical loss increases due to longer transmission length and wire bonds
Solution Approach 1:
The patent transitions from 2D side-by-side component placement to 3D vertical stacking architecture. Multiple components including the optical engine, electrical engine, and memory are stacked vertically on the substrate, enabling compact integration while reducing board area consumption and interconnect length.
Solution Approach 2:
The patent implements nested packaging where components are housed within each other's vertical space. The optical engine and electrical engine are stacked one above the other, with each engine containing its sub-components in a nested manner, maximizing space utilization and minimizing overall footprint.
2Ease of manufacture
If wire bonds are used for electrical interconnect between chips, then electrical connections can be established, but electrical loss increases and signal integrity degrades at high frequencies
Solution Approach 1:
The patent removes wire bonds from the electrical interconnect architecture. Instead of using wire bonds between chips, the invention uses direct substrate-based interconnects and vertical stacking with short-trace connections, eliminating the inductance and resistance problems associated with wire bonds.
Solution Approach 2:
The patent replaces the mechanical wire bond system with an integrated circuit board trace system. Electrical connections are achieved through controlled impedance traces on the substrate and vertical interconnect access structures, providing lower inductance and better signal integrity for high-frequency applications.
3Device complexity
If traditional cable communication is used, then simple infrastructure is required, but bandwidth and transmission speed are limited
Solution Approach 1:
The patent replaces traditional electrical cable communication with optical fiber communication. The optical engine integrates laser diodes, modulators, and photodetectors to convert electrical signals to optical signals and back, enabling high-bandwidth, long-distance transmission that overcomes the limitations of electrical cables.
4Productivity
If optical components are integrated on silicon substrates, then large-scale silicon photonics integrated circuits can be fabricated, but integration of all components within smaller module package becomes challenging
Solution Approach 1:
The patent uses 3D vertical stacking to integrate multiple large-scale silicon photonics integrated circuits and electronic components within a compact footprint. By stacking optical engines, electrical engines, and memory vertically, the system achieves high integration density while minimizing the horizontal package area.
Data Source
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AI summary
An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical modules.