Optical Device Molding System With Middle Plate Through-Holes
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Solution Overview
Problem
Existing molding systems for electronic devices with optical elements, such as LEDs, face issues with yield, productivity, precision, and material waste, particularly due to contamination risks in compression molding and inefficiencies in dispensing and injection molding.
Innovation Solution
A transfer-molding system using a liquid molding compound, with a clamping mechanism and through-holes in a middle plate to prevent compound leakage, combined with a plunger and runners to distribute the compound precisely onto pre-molded caps on a substrate, allowing for precise encapsulation of LED devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If compression molding is used to mold optical elements, then productivity is improved, but contamination on the substrate's electrical contacts occurs
Solution Approach 1:
The mold is divided into multiple cavities, each capable of independently molding optical elements. This segmentation allows simultaneous molding of multiple elements without requiring flow paths that connect all units, thereby preventing contamination on electrical contacts while maintaining high productivity through parallel processing.
Solution Approach 2:
A transfer molding mechanism is introduced as an intermediary between material supply and cavity filling. The plunger system acts as a mediator that precisely delivers molding compound to each cavity through controlled transfer, eliminating the need for interconnected flow paths and preventing contamination of electrical contacts.
2Manufacturing precision
If dispensing or injection molding is used, then molding can be performed, but yield and productivity are unsatisfactory and precision is lacking
Solution Approach 1:
The molding compound is pre-prepared and positioned in a controlled manner before the actual molding process. The plunger system pre-loads and precisely positions the compound for transfer to each cavity, ensuring consistent precision while maintaining high productivity through efficient material delivery.
Solution Approach 2:
The molding process utilizes controlled changes in pressure and temperature parameters during the transfer molding operation. By precisely controlling these parameters, the system achieves high manufacturing precision for optical elements while maintaining productivity through efficient, repeatable cycles.
3Loss of substance
If dispensing or injection molding is used, then molding can be performed, but material waste is substantial
Solution Approach 1:
The transfer molding system enables precise delivery of molding compound to each cavity with minimal excess. Any excess material can be recovered and reused, significantly reducing material waste while maintaining high productivity through efficient material utilization across multiple cavities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables improved yield, reduced material waste, and enhanced precision in molding LED devices with better light emission quality by preventing contamination and optimizing the distribution of the molding compound.
Implementation Method 1
a plunger operative to push the liquid molding compound onto the pre-molded cap through runners into the cavity
Implementation Method 2
resilient means for applying a compression force on the pre-molded cap
Data Source
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Figure 5
AI summary
A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding.