Optical Component Mount with Heat Conductive Brackets
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optomechanical mounts for optical components in laser devices face challenges in temperature stabilization, responsiveness, and miniaturization, with issues such as thermal contact loss, high thermal inertia, and non-uniform heat distribution, leading to mechanical stresses and slow response times.
Innovation Solution
A mount design that decreases the volume of the thermally active part by using heat conductive brackets surrounding the optical element, with point or linear contacts between thermally active and inactive parts, and materials with high or low thermal conductivity, allowing for efficient heat distribution and miniaturization, suitable for various optical component geometries and thermal loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the volume of the mechanical mount is decreased to improve temperature responsiveness, then the response time of temperature stabilization is improved, but the thermal contact between contact blocks and holder is lost due to thermal expansion
Solution Approach 1:
The mount is divided into a thermally active part (contact blocks and optical element) and a thermally inactive part (holder), allowing the active part to be miniaturized for fast response while the inactive part provides stable mechanical support. The thermal connection between parts is maintained through point or linear contacts that accommodate thermal expansion.
Solution Approach 2:
Different parts of the mount have different thermal properties: the contact blocks and optical element form a thermally active region with high thermal conductivity for rapid temperature stabilization, while the holder is thermally inactive with lower thermal conductivity for mechanical stability. This local differentiation resolves the contradiction between fast response and maintained thermal contact.
2Loss of time
If the volume of the thermally active part is decreased to improve response times, then temperature stabilization responsiveness is improved, but the uniform heat distribution across optical component surfaces becomes difficult to maintain
Solution Approach 1:
The optical element is nested within a cavity of the holder, surrounded by contact blocks that provide thermal connection. This nested arrangement allows the miniaturized thermally active part to maintain intimate thermal contact with all surfaces of the optical element, ensuring uniform heat distribution despite the reduced volume.
Solution Approach 2:
The contact blocks are positioned to surround the optical element in three dimensions, providing thermal connection from multiple directions. This multi-dimensional thermal approach ensures uniform heat distribution across all surfaces of the optical component while maintaining a compact thermally active volume.
3Loss of time
If the mount is miniaturized to reduce thermal inertia, then the response time of temperature stabilization is improved, but the mechanical stability and location of the optical element becomes more difficult to maintain
Solution Approach 1:
The mount is segmented into a compact thermally active part containing the optical element and contact blocks, and a larger thermally inactive holder providing mechanical support. This segmentation allows the active part to be miniaturized for fast thermal response while the inactive holder maintains mechanical stability and precise optical element positioning.
Solution Approach 2:
The holder acts as an intermediary between the miniaturized thermally active part and the external environment, providing stable mechanical mounting and isolation from thermal disturbances. This intermediary structure enables the small active part to achieve fast response times while the overall system maintains mechanical stability.
4Temperature
If the optical element is heated to a fixed temperature above the working temperature range, then temperature stabilization is achieved, but excessive thermal loads are applied to the optical component
Solution Approach 1:
The heating function is extracted from the optical element itself and placed in the holder, which is thermally isolated from the optical element except through controlled contact blocks. This extraction allows temperature stabilization to be achieved while minimizing direct thermal loading on the optical component, as the holder can be made of low thermal conductivity material.
Solution Approach 2:
The thermal conductivity parameter is varied spatially: the contact blocks have high thermal conductivity for efficient heat transfer to the optical element, while the holder has low thermal conductivity to minimize excessive thermal loads. This parameter differentiation enables temperature stabilization without applying excessive thermal stress to the optical component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature stabilization response times, reduces mechanical stresses, and allows for flexible adjustment and miniaturization of the optomechanical assembly, improving heat management and stability for optical components like laser rods and crystals.
Implementation Method 1
Heat conduction in case of the heating of the optical element a1 is represented by arrows in figure 1a... the heating/cooling element a6... Brackets a2 and a3 are thermally regulated through the heating/cooling element a6 on the upper pressing cover a5
Implementation Method 2
The thermally active part a7 is disconnected from the thermally inactive part, which allows decreasing of the volume of the thermally active mount... The thermally active part a7 and includes the optical element a1, brackets a2 and a3, the pressing cover a5 and the heating/cooling element a6
Data Source
Figure 1a~1b
Figure 1c~1d
Figure 2~3
AI summary
The present invention relates to optoelectronic laser devices, more precisely it relates to a mount for mounting optical components with an emphasis on temperature stabilization and their adjustment. The mount for temperature stabilization of optical components is characterized in that improved temperature responsiveness of the optomechanic assembly is achieved, and in addition uniform heat supply or removal, respectively, from entire side surfaces of the optical component is ensured by decreasing of the volume of thermally active part of the mount and by placing heat conducting brackets, which surround the optical element; that a disconnection of the thermally active part and a thermally inactive part of the mount is achieved with point or line contacts or the thermally active part is made of a material with high thermal conductivity, while the thermally inactive part of the mount is made of a material with low thermal conductivity; that the mount can be made from a single piece, which allows further simplification for cylindrically shaped optical components, for which the mechanical mount from one piece also functions as heat conductive brackets.