Optical Mount Assembly for Passive Alignment Stability
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Solution Overview
Problem
The fabrication of semiconductor optical devices requires precise alignment of optical components, which is time-consuming and unreliable due to active alignment methods, making it difficult to secure lenses with respect to fibers and waveguides.
Innovation Solution
A semiconductor optical device design featuring alignment features in through apertures and OD mounts, allowing passive alignment and securement using adhesives, enabling precise fabrication without active alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment methods are used to align optical components, then manufacturing precision is improved, but manufacturing time and complexity increase
Solution Approach 1:
Alignment features (ledges, overcut portions, alignment marks) are pre-formed in the semiconductor substrate during fabrication before optical components are mounted. This preliminary preparation of alignment structures eliminates the need for time-consuming active alignment during assembly, as components can be directly positioned using the pre-formed features.
Solution Approach 2:
The optical components and semiconductor substrate have complementary alignment features that automatically guide and constrain each other into correct positions during assembly. The ledges and overcut portions create mechanical interlocking that self-aligns components without requiring external alignment equipment or adjustment procedures.
2Manufacturing precision
If active alignment methods are used to align optical components, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
Alignment features are integrated into the semiconductor substrate fabrication process itself, forming ledges, overcut portions, and alignment marks as part of the standard manufacturing sequence. This eliminates the need for separate, complex alignment equipment and procedures during optical component assembly.
Solution Approach 2:
The patent replaces complex mechanical alignment systems (requiring adjustment mechanisms, alignment equipment, and manual procedures) with simple geometric features formed in the substrate. The ledges and overcut portions provide passive mechanical guidance that constrains component positions through geometry alone.
3Reliability
If lenses are secured in place after alignment, then reliability is improved, but the securing process becomes difficult to achieve
Solution Approach 1:
The semiconductor substrate is prepared with pre-formed ledges and overcut portions that create ready-made mounting structures. These features are formed during substrate fabrication, so when optical components are mounted, they can be immediately secured using simple adhesive application without complex securing mechanisms.
Solution Approach 2:
The ledges and overcut portions act as intermediary structures between the optical components and the semiconductor substrate. These intermediate features provide a dedicated mounting interface that simplifies the securing process, allowing adhesives to be applied in a controlled manner and ensuring reliable bonding without requiring complex securing mechanisms.
4Reliability
If lenses are secured in place after alignment, then reliability is improved, but long-term stability becomes unreliable
Solution Approach 1:
The ledges and overcut portions are formed with precise dimensions during substrate fabrication, creating optimized mounting surfaces that ensure consistent adhesive bonding. This preliminary preparation of mounting features with controlled geometry ensures that the securing achieves both immediate reliability and long-term stability.
Solution Approach 2:
The ledges and overcut portions serve as intermediate bonding interfaces that distribute mechanical and thermal stresses away from the adhesive joint. By providing a dedicated mounting structure with increased surface area and mechanical interlocking, these features enhance the durability and long-term reliability of the secured optical components.
Data Source
AI summary
An optical device (OD), a semiconductor wafer structure (SWS) and a method of making the same are provided. The OD has a first semiconductor member (FSM), a second semiconductor member (SSM) and an OD mount. The OD mount has an optical component whose function is to receive an optical beam (OB) from a source and provide the OB to a destination. A portion of the OD mount is held in a cavity defined by the FSM and the SSM. The OD mount is fixedly secured to the FSM and to the SSM. The FSM and the SSM are also fixedly secured to each other. The OD may be integrated in opto-electrical device. Having the support portion of the OD mount held in place in the cavity minimizes movement of OD mount during operation of the OE device, thereby minimizing movement of the optical beam. The SWS comprises multiples instances of the OD. Manufacturing the SWS is achieved using passive optical alignment.