Mounting Ring and Bonding Layer for Optical Element Alignment
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Solution Overview
Problem
Conventional optical system assembly techniques require tight tolerances for high-precision manufacturing, limiting mass production and increasing costs due to stringent alignment and attachment requirements for optical elements like mirrors, lenses, and beamsplitters.
Innovation Solution
The use of mounting rings and bonding layers to securely attach optical elements to metering structures, allowing for looser manufacturing tolerances and facilitating alignment with optical paths, while maintaining stability across temperature extremes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional direct mounting techniques are used to attach optical elements, then alignment precision can be maintained, but manufacturing complexity and cost increase due to tight tolerance requirements
Solution Approach 1:
The patent introduces a mounting ring as an intermediary component between the optical element and the metering structure. The mounting ring includes a receiving interface that receives the mounting stem of the optical element, and it is surrounded by a bonding layer that attaches it to the metering structure. This intermediary mounting ring absorbs alignment tolerances and simplifies the manufacturing process while maintaining the required alignment precision of the optical element.
2Manufacturing precision
If tight tolerances are enforced for optical element mounting, then alignment accuracy is improved, but productivity decreases due to iterative measurement and redesign
Solution Approach 1:
The mounting ring serves as a tolerance-absorbing intermediary that decouples the tight alignment requirements from the manufacturing process. By providing a standardized receiving interface for optical elements and attaching to the metering structure via a bonding layer, it allows for looser manufacturing tolerances on the metering structure while maintaining precise optical alignment, thereby eliminating iterative measurement and redesign cycles.
Solution Approach 2:
The patent changes the mounting approach from direct rigid attachment to a flexible bonding layer attachment. The bonding layer allows for parameter variations in the mounting stem dimensions and positioning while maintaining functional alignment, enabling mass production with standard tolerances rather than requiring precision machining at every interface.
3Manufacturing precision
If high-precision manufacturing processes are used for optical elements, then quality is improved, but cost increases due to stringent attachment requirements
Solution Approach 1:
The mounting ring acts as a cost-reducing intermediary that separates the high-precision optical element fabrication from the lower-precision metering structure manufacturing. The standardized receiving interface in the mounting ring maintains optical quality requirements while the bonding layer attachment to the metering structure allows for cost-effective manufacturing with standard tolerances, reducing overall system cost.
4Device complexity
If direct mounting without bonding layers is used, then assembly is simpler, but tolerance accumulation impedes high accuracy
Solution Approach 1:
The mounting ring with bonding layer attachment serves as a tolerance-breaking intermediary. While it adds a component to the assembly, it prevents tolerance accumulation by providing a standardized interface that absorbs dimensional variations. The bonding layer allows for self-alignment and compensation of manufacturing tolerances, maintaining cumulative accuracy without requiring ultra-precise direct mating surfaces.
Data Source
AI summary
Techniques are disclosed for mounting optical elements in optical systems. A system may include a mirror assembly. The mirror assembly may include a mounting stem and a mirror. The system may further include a mounting ring. The system may further include a metering structure. The metering structure may include a receiving interface having an inner surface defining an aperture. The metering structure may be configured to receive the mounting stem within the aperture and receive the mounting ring within a gap between the mounting stem and the inner surface. The system may further include a bonding layer disposed between the mounting stem and the mounting ring. Additional apparatus and related methods are provided.