Optical Mouse IC Integrated Structure with Light Shield
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Solution Overview
Problem
Conventional optical mice have a large occupied space due to separately installed optical sensors, lenses, and light-emitting diodes, leading to increased costs, assembly difficulties, and reduced efficiency, with mismatched components affecting performance and stability.
Innovation Solution
An IC integrated structure for optical mice, featuring a bracket connected to a PCB with an integrated LED wafer, main control IC wafer, and optical lens, where the LED and IC wafers are mounted at the bracket's ends, and the optical lens is positioned above, with a light shield and through hole for light transmission, reducing space and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If optical sensor, optical lens and light-emitting diode are separately assembled in conventional optical mice, then each component can be independently manufactured, but the occupied space increases and assembly complexity increases
Solution Approach 1:
The patent merges the optical sensor, optical lens, and light-emitting diode into a single integrated wafer structure. The wafer contains all three components arranged in a predetermined pattern, eliminating the need for separate assembly and significantly reducing the occupied space while maintaining independent manufacturing capabilities through wafer-level fabrication processes.
2Adaptability or versatility
If optical sensor, optical lens and light-emitting diode are separately assembled, then component flexibility is maintained, but assembly time increases and matching precision decreases
Solution Approach 1:
By integrating all optical components onto a single wafer, the patent eliminates multi-step assembly processes. The entire optical assembly can be manufactured as one unit through wafer-level processing, dramatically reducing assembly time while ensuring precise spatial relationships between components are maintained during fabrication rather than assembly.
Solution Approach 2:
The patent performs preliminary arrangement of all optical components during the wafer fabrication process itself. The optical sensor, lens, and LED are positioned in their final configurations before the wafer is installed in the mouse, ensuring precise matching without requiring time-consuming post-assembly adjustments.
3Ease of repair
If optical sensor, optical lens and light-emitting diode are separately assembled, then individual component replacement is possible, but assembly difficulty increases and matching precision decreases
Solution Approach 1:
The integration of all optical components onto a single wafer ensures that their relative positions and orientations are precisely controlled during wafer fabrication. This unified structure guarantees optimal matching precision between components while the entire wafer can be replaced as a single unit, simplifying repair procedures.
4Adaptability or versatility
If conventional separate assembly is used, then component sourcing is flexible, but production cost increases and quality consistency decreases
Solution Approach 1:
The patent consolidates multiple optical components into a single wafer that can be manufactured in high volumes using standardized wafer fabrication processes. This approach improves production efficiency through economies of scale while maintaining quality consistency across all components fabricated on the same wafer batch.
5Ease of operation
If optical lens is large in size for separate assembly, then assembly tolerance is easier to achieve, but production cost increases
Solution Approach 1:
By integrating the optical lens with other components on a compact wafer, the patent reduces the overall size of the optical assembly. The precise positioning of the lens is achieved through wafer-level fabrication techniques, maintaining assembly tolerance while significantly reducing material usage and production cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated structure reduces occupied space, simplifies assembly, lowers material costs, and enhances stability by ensuring uniform component alignment, improving production efficiency and reducing the risk of component mismatch issues.
Implementation Method 1
a light shield configured for shielding an external light source is arranged between the optical lens and the main control IC wafer
Implementation Method 2
a through hole configured for transmitting light is formed in the light shield
Implementation Method 3
an optical lens and the light emitting diode are essential components of the optical mouse
Data Source
AI summary
An IC integrated structure for an optical mouse of the invention comprises a bracket configured for being connected with a PCB, an LED wafer for emitting light, a main control IC wafer and an optical lens; wherein the LED wafer and the main control IC wafer are respectively mounted at two ends of a terminal surface inside a bracket frame, the LED wafer and the main control IC wafer are connected with the PCB by the bracket, and the optical lens is mounted above the LED wafer and the main control IC wafer; a light shield configured for shielding an external light source is arranged between the optical lens and the main control IC wafer, and a through hole configured for transmitting light is formed in the light shield.