Optical Multi-Coupler Architectures for Faster PIC Co-Packaging
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Solution Overview
Problem
The packaging of multiple photonic integrated circuits (PICs) using traditional butterfly systems with multiple couplers or fiber arrays is time-consuming and costly, and there is a need for more efficient and cost-effective optical co-packaging solutions.
Innovation Solution
A single optical multi-coupler is used to connect multiple PICs, enabling advanced optical co-packaging with reduced cost, higher yield, and improved alignment through various multi-coupler architectures and assembly techniques, including V-groove coupling, kinematic features, and fiber coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional butterfly systems with multiple couplers or fiber arrays are used to package multiple PICs, then optical connectivity between PICs is achieved, but the packaging process becomes time-consuming and costly
Solution Approach 1:
The patent merges multiple separate couplers into a single multi-coupler device that can simultaneously connect multiple PICs. This consolidation reduces the number of individual coupling operations required, thereby decreasing packaging time while maintaining optical connectivity among all PICs through the integrated multi-coupler structure
Solution Approach 2:
The multi-coupler device is designed with universal functionality to handle multiple optical coupling connections simultaneously. A single multi-coupler can provide coupling interfaces for multiple PICs, replacing the need for multiple dedicated couplers and fiber arrays, thus streamlining the packaging process without compromising connectivity reliability
2Reliability
If traditional butterfly systems with multiple couplers or fiber arrays are used to package multiple PICs, then optical connectivity between PICs is achieved, but the packaging cost increases
Solution Approach 1:
By combining multiple coupler functions into a single multi-coupler device, the patent reduces the total number of components required for packaging. This consolidation lowers material costs, reduces assembly complexity, and decreases manufacturing time, all of which contribute to reduced overall packaging cost while maintaining the necessary optical connectivity
Solution Approach 2:
The multi-coupler provides universal coupling capability for multiple PICs, eliminating the need to manufacture and assemble multiple separate coupler assemblies. This multi-functional approach reduces manufacturing complexity and cost while ensuring reliable optical connections across all PIC interfaces
3Reliability
If traditional coupling methods are used to connect multiple PICs, then optical channels are connected, but alignment precision is insufficient
Solution Approach 1:
The multi-coupler serves as an intermediary device with integrated alignment features that mediate the connection between multiple PICs. These alignment features provide reference structures that guide precise positioning, ensuring accurate alignment of optical channels across all connected PICs while maintaining reliable optical connection
Data Source
AI summary
An apparatus comprising a coupler comprising a first interface to attach to a first photonic integrated circuit; a second interface to attach to a second photonic integrated circuit; and a waveguide to couple an optical channel of the first photonic integrated circuit to an optical channel of the second photonic integrated circuit.