Optical Nanostructure Integration for Thin Photonic Die Coupling
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Solution Overview
Problem
Integration of multiple semiconductor devices in wafer-level packaging poses challenges, particularly in achieving efficient optical transformations and reducing component complexity and thickness.
Innovation Solution
Incorporation of optical nanostructures in semiconductor devices to perform optical transformations before radiation reaches the grating coupler, eliminating the need for multiple optical components and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple optical components are used to achieve optical transformations, then optical functionality is improved, but device complexity and thickness increase
Solution Approach 1:
The patent combines multiple optical components into a single integrated optical device that performs multiple optical transformations (focusing, collimating, beam shaping) simultaneously. This merging approach maintains the optical functionality while reducing the number of discrete components and overall device thickness.
Solution Approach 2:
The optical device is designed with multi-functional capabilities to perform various optical transformations through different regions or modes of the same component structure, eliminating the need for separate specialized components for each function.
2Adaptability or versatility
If multiple optical components are stacked to achieve optical transformations, then optical functionality is improved, but device thickness increases
Solution Approach 1:
The patent transitions from a vertical stacking arrangement of multiple optical components to a planar or laterally-integrated configuration. By redistributing optical functions across different spatial dimensions within a single device plane, the overall thickness is reduced while maintaining optical transformation capabilities.
3Productivity
If traditional wafer-level packaging is used, then manufacturing efficiency is maintained, but integration of multiple semiconductor devices becomes difficult
Solution Approach 1:
The patent divides the wafer into multiple device unit regions, each capable of independent processing and packaging. This segmentation allows parallel processing of multiple devices while maintaining wafer-level manufacturing efficiency, and enables flexible integration configurations without compromising production throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances flexibility in optical configuration, reduces component count, and maintains manufacturing efficiency while achieving desired optical effects.
Implementation Method 1
Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located
Data Source
AI summary
A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupler to receive radiation of predetermined wavelength incident on the grating coupler. The optical die is disposed over the photonic die and includes a substrate with optical nanostructures. Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located. The optical nanostructures overlie the grating coupler so that the incident radiation of predetermined wavelength crosses the optical die where the optical nanostructures are located before reaching the grating coupler.