Optical Node Substrate Integrating System and Converter Cards
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Solution Overview
Problem
Existing DWDM network elements are complex and error-prone to install due to the presence of repeated common circuitry and numerous external optical interconnect cables and patch panels, leading to increased costs and installation difficulties.
Innovation Solution
A node configuration that integrates system optics cards with optical converter cards, reducing redundant components and integrating optical cabling, which simplifies the design and installation by eliminating the need for external connectors and cables, while providing multiple communication degrees through a single substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple individual circuit packs with repeated common circuitry are used to construct a DWDM network element, then functional versatility is improved, but device complexity increases and installation becomes error-prone
Solution Approach 1:
The patent combines multiple individual circuit packs into a single integrated circuit board that houses all functional components (optical multiplexing, demultiplexing, amplification, monitoring) without repeated common circuitry. This merging eliminates the need for multiple separate packs while maintaining full functionality, directly resolving the contradiction between versatility and complexity.
Solution Approach 2:
The integrated circuit board serves as a universal platform that performs multiple DWDM functions simultaneously. Rather than requiring separate specialized circuit packs for each function, the single board provides multi-functional capability through shared common circuitry and standardized interfaces, reducing overall system complexity while preserving adaptability.
2Adaptability or versatility
If numerous external optical interconnect cables and patch panels are used to interconnect circuit packs, then connectivity flexibility is improved, but ease of operation deteriorates and installation becomes error-prone
Solution Approach 1:
The patent integrates optical interconnect pathways directly within the circuit board substrate, merging what were previously external cables and patch panels into internal routed connections. This eliminates the need for numerous external optical interconnects while maintaining connectivity flexibility through designed-in optical paths, significantly improving ease of installation and reducing error-prone connections.
3Quantity of substance
If high-density parallel optical connectors are used on circuit pack front panels, then connectivity capacity is improved, but device complexity increases and installation difficulty increases
Solution Approach 1:
The patent extracts the high-density parallel optical connector functionality from the front panel and integrates it directly into the circuit board architecture. By taking out the complexity of high-density connectors from the user-facing panel and embedding them within the board's internal structure, the system maintains high connectivity capacity while dramatically simplifying installation and reducing front panel complexity.
4Measurement precision
If optical power monitoring circuitry is distributed throughout the system on each circuit pack, then measurement coverage is improved, but device complexity increases and cost increases
Solution Approach 1:
The patent consolidates optical power monitoring circuitry from multiple distributed locations on separate circuit packs into a single integrated monitoring system on the unified circuit board. This merging maintains comprehensive measurement coverage across all optical channels while eliminating the redundancy of repeated monitoring circuitry, thereby reducing device complexity and cost.
Data Source
AI summary
A node for managing an optical signal includes a first system optics card for providing channels to be transported over a first optical transport link and receives channels from a second optical transport link. Channels received over the second optical transport link are provided to an optical converter card for transport to a client device, for feedback onto the first optical transport link, or pass through to a second system optics card of the node. The first system optics card is capable of dropping network channels from the second transport link to associated client devices through optical converter cards and add client channels received from optical converter cards to the first transport link. The first system optics card may include one or more express input and output ports to couple with one or more other system optics cards in order to provide multiple degrees of communication capability.