Optical Package Structure With Backside Waveguides and Through Vias
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Solution Overview
Problem
New packaging technologies for semiconductor dies face manufacturing challenges due to the complexity of integrating electrical and optical devices within a compact package structure, which requires efficient routing and reduced size to enhance production efficiency and lower costs.
Innovation Solution
A package structure is formed with electrical devices on the front side and optical devices on the backside, connected via conductive structures to reduce routing length and integrate both devices on a single wafer, utilizing techniques such as forming interconnect structures, backside through vias, and waveguide layers to facilitate efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical and optical devices are integrated within a compact package structure, then production efficiency is improved and costs are lowered, but manufacturing complexity increases
Solution Approach 1:
The package structure is divided into distinct front side and back side regions, with electrical devices located on the front side and optical devices located on the back side. This segmentation allows for specialized processing of each device type while maintaining integration within a single package, thereby improving production efficiency without excessively increasing manufacturing complexity
Solution Approach 2:
The patent utilizes the third dimension (vertical stacking) by placing electrical and optical devices on opposite sides of the package structure. This dimensional arrangement reduces routing length and allows for efficient interconnection through conductive structures that traverse the package thickness, enabling compact integration while managing manufacturing complexity
2Length of moving object
If electrical devices and optical devices are connected via conductive structures, then routing length is reduced, but device complexity increases
Solution Approach 1:
The conductive structures serve a dual function by providing both electrical interconnection between devices and structural support for routing signals across the package. This merging of functions reduces the need for separate routing elements, thereby reducing overall routing length while managing device complexity
Solution Approach 2:
The conductive structures are designed to perform multiple functions: electrical interconnection, mechanical support, and signal routing. This multi-functionality allows the package to achieve compact dimensions with reduced routing length without proportionally increasing device complexity, as the same structural elements serve multiple purposes
Data Source
AI summary
A package structure and a formation method are provided. The method includes forming electrical devices over a substrate and forming an interconnect structure over front sides of the electrical devices. The method also includes thinning the substrate and forming backside through vias connecting to backsides of the electrical devices. The method also includes attaching a waveguide layer over backsides of the electrical devices and forming conductive vias through the waveguide layer and electrically connected to the backside through vias.