Optical Apparatus Package Structure Miniaturization
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Solution Overview
Problem
Conventional optical proximity sensors face challenges in reducing size and volume due to wire bonding for light detectors and the use of shielding structures that hinder miniaturization.
Innovation Solution
A package structure featuring a substrate with a light emitting device and a chip scale package light sensing device, connected via conductive materials, and a multilayer film or light barrier member to manage light reflection and ambient light, eliminating the need for wire bonding and shielding structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically connect the light detector to the package housing, then reliable electrical connection is achieved, but the size of the accommodating space cannot be reduced
Solution Approach 1:
The patent replaces wire bonding (mechanical/electrical connection method) with a CSP (Chip Scale Package) light detector that is directly mounted on the package housing. This substitution eliminates the need for separate wire bonding processes and reduces the space required for electrical connections, thereby reducing the accommodating space size while maintaining reliable electrical connection through direct mounting contacts.
2Reliability
If a shielding structure is disposed between the light source and photodetector to prevent direct light reception, then optical interference is prevented, but the overall volume of the optical sensor cannot be effectively reduced
Solution Approach 1:
The patent extracts and removes the separate shielding structure from the optical sensor design. Instead of adding a shielding component between the light source and photodetector, the invention relies on the inherent directional characteristics of the components and the compact CSP packaging to prevent direct light reception, thereby eliminating the volume occupied by the shielding structure while maintaining optical interference prevention.
Solution Approach 2:
The patent merges the shielding function into the overall package structure design rather than using a separate component. The package housing itself and the relative positioning of the light source and CSP light detector are designed to inherently prevent direct light paths, combining the structural support and optical shielding functions into a unified compact design.
3Ease of manufacture
If conventional packaging methods are used for the light detector, then ease of manufacture is maintained, but the size of the optical apparatus cannot be reduced
Solution Approach 1:
The patent changes the packaging parameters of the light detector by adopting CSP (Chip Scale Package) technology. This parameter change reduces the size of the light detector package to be comparable to or smaller than the light source package, enabling miniaturization of the overall optical apparatus while maintaining manufacturability through established CSP fabrication and mounting processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall size and volume of the optical apparatus, enhances optical performance, and lowers manufacturing costs and complexity.
Implementation Method 1
a light emitting device (220) for emitting light
Implementation Method 2
when an object 101 approaches the conventional optical proximity sensor 100, the light beam L1 emitted from the light source 110 is reflected by the object 101 so as to be received by the light detector 120
Implementation Method 3
a multilayer film (310) which is disposed on or above the light sensing device (230), wherein at least a portion of the light reflected by the object passes through the multilayer film to be received by the light sensing device (230)
Implementation Method 4
a light barrier member (240) is disposed around a periphery of the light sensing device (230)
Data Source
AI summary
The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.