Optical Package Structure Direct Soldering Eliminates Silver Glue Peeling
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Solution Overview
Problem
Conventional optical package structures face issues with thermal expansion coefficient mismatches leading to silver glue peeling and metal wire breakage, resulting in defective products due to differing thermal expansion coefficients when soldered on circuit boards.
Innovation Solution
The optical package structure includes a first and second conductive frame with die-bonding portions and an exposed portion, where the light receiver's soldering portions are directly soldered onto these frames without silver glue or metal wires, embedded in a light-permeable package compound, forming a light entrance that allows only specific light signals to reach the receiver.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silver glue and metal wires are used to connect the light receiver to the conductive frames, then the connecting strength is enhanced, but the silver glue peels off and metal wires break due to thermal expansion coefficient mismatches during soldering
Solution Approach 1:
The patent removes the silver glue and metal wire components from the connection structure. Instead of using these intermediate connection elements, the light receiver is directly soldered to the conductive frames, eliminating the sources of connection failure due to thermal expansion mismatches.
Solution Approach 2:
The patent merges the connection function directly into the soldering process between the light receiver and conductive frames, eliminating the need for separate silver glue bonding and metal wire connection steps. This integration reduces the number of interfaces and potential failure points.
2Strength
If silver glue is used to cover the connecting junction, then the connecting strength is enhanced, but the silver glue peels off during soldering due to thermal expansion differences
Solution Approach 1:
The patent extracts and removes the silver glue from the connection structure, eliminating it as a component that could peel off during thermal processing. The connection is achieved through direct soldering without silver glue coverage.
3Reliability
If metal wires are used to electrically connect the light receiver, then the electrical connection is established, but the metal wires break easily during soldering due to thermal expansion coefficient mismatches
Solution Approach 1:
The patent removes the metal wire component from the electrical connection structure. The light receiver is directly soldered to the conductive frames, eliminating the metal wires that are prone to breaking during thermal processing.
Solution Approach 2:
The patent merges the electrical connection function directly into the soldering joint between the light receiver and conductive frames, eliminating the need for separate metal wire interconnectors and reducing the number of potential failure points.
4Stability of the object's composition
If the light receiver, metal wires, and silver glue are embedded in the light-permeable package compound, then the structural integrity is improved, but the entire structure becomes defective if any metal wire has a flaw
Solution Approach 1:
The patent extracts and removes the metal wire component from the embedded structure. By eliminating metal wires and silver glue, the patent removes the sources of defects that could propagate through the entire packaged structure, while maintaining structural integrity through direct soldering connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the defective rate of optical package structures by eliminating the need for silver glue and metal wires, ensuring reliable light signal reception and transmission while shielding other light signals, thereby enhancing the structural integrity and functionality.
Implementation Method 1
The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance
Data Source
AI summary
An optical package structure includes a first conductive frame, a second conductive frame, a light receiver, and a light-permeable package compound. The first and second conductive frames are arranged apart from each other and have a light entrance there-between. The light receiver includes a light receiving region and two soldering portions arranged on a surface thereof. The two soldering portions are respectively arranged at two opposite sides of the light receiving region, and are respectively soldered onto the first and second conductive frames, such that the light receiving region faces the light entrance. At least part of the first conductive frame, at least part of the second conductive frame, and the light receiver are embedded in the light-permeable package compound. The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance.