Micro Optical Package Filtration Layers for Light Interference
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Solution Overview
Problem
Conventional optical package structures are limited by the need for barriers or protective covers to prevent light interference, which hinders microminiaturization and increases costs due to the requirement for additional filters to filter out visible lights of different wavelengths.
Innovation Solution
A micro optical package structure with filtration layers formed on packaging resin bodies that enclose light-emitting and light-receiving chips, eliminating the need for external barriers or filters, and using these layers to filter out specific wavelengths without additional processing steps or materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a package shell with partition is used to separate light-emitting chip from light-receiving chip, then light interference is prevented, but device complexity and size increase
Solution Approach 1:
The patent extracts the light-blocking function from the package shell structure and relocates it to the resin body material itself. The resin body is formulated with light-absorbing additives that selectively absorb light in the wavelength range of the light-receiving chip, eliminating the need for separate partition structures within the package shell.
Solution Approach 2:
The resin body is given multiple functions: it provides structural support, optical coupling, and light filtering simultaneously. By incorporating light-absorbing additives into the resin material, the same component that holds and protects the chips also performs the light-blocking function, reducing overall device complexity.
2Object-affected harmful factors
If additional filters are installed to block visible lights of different wavelengths, then optical sensitivity is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the filtering function with the resin body material by incorporating light-absorbing additives directly into the resin formulation. This eliminates the need for separate filter components and their associated mounting, alignment, and sealing processes, significantly simplifying manufacturing.
Solution Approach 2:
The patent changes the optical parameters of the resin body by adding light-absorbing materials that selectively absorb specific wavelength ranges. This modifies the resin's transmission characteristics to block visible light while maintaining transparency to the operational wavelengths, achieving filtering without additional components.
3Measurement precision
If partition structure is added to block scattered light, then light-receiving sensitivity is improved, but device size increases
Solution Approach 1:
The patent applies light-absorbing properties locally within the resin body at strategic positions between the light-emitting and light-receiving chips. Rather than using a full partition structure, localized light-blocking regions are created within the resin material to prevent scattered light from reaching the receiver, minimizing space requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables microminiaturization of optical packages by preventing light interference through scattering or diffraction without external barriers and simplifies manufacturing by integrating wavelength filtering directly onto the resin bodies, reducing costs and complexity.
Implementation Method 1
The filtration layers are formed on surfaces of the packaging resin bodies, for filtering out lights of different wavelengths
Data Source
AI summary
A micro optical package structure with filtration layers includes a substrate having a light-emitting area and a light-receiving area, a light-emitting chip being deposited in a light-emitting area, a light-receiving chip being deposited in a light-receiving area, two packaging resin bodies for enclosing the light-emitting chip and the light-receiving chip, respectively, and being separately deposited in the light-emitting area and the light-receiving area, respectively, and the filtration layers formed on the packaging resin bodies surface for filtering out lights of different wavelengths. The micro optical package structure needs neither barrier nor protective cover between or outside the packaging resin bodies, so can be microminiaturized. The micro optical package structure can filter out visible lights of specific wavelengths without using any additional filters.