Optical Electronic Package With Integrated Substrate
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Solution Overview
Problem
Existing electronic packages with optical detectors and transmitters require complex mounting steps, large dimensions, and external electrical connection difficulties, making them inefficient and costly.
Innovation Solution
A simplified electronic package design featuring a substrate wafer with integrated circuit chips, a transparent encapsulation means for optical coupling, and an opaque encapsulation block with strategically placed through openings for light diffusion, allowing for efficient light transmission and reception while reducing size and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mounting plates and specially sized covers are used to create separate chambers for optical chips, then optical isolation and chip protection are achieved, but the device dimensions become large and the structure becomes complex
Solution Approach 1:
The patent merges the mounting plate, optical chamber, and encapsulation functions into a single integrated substrate. The substrate simultaneously serves as the mechanical support, the optical isolation barrier, and the mounting surface for all components, eliminating the need for separate mounting plates and covers while maintaining optical isolation between transmitter and receiver chips.
Solution Approach 2:
The substrate is designed as a multi-functional component that performs multiple roles: mechanical support for chips, optical isolation barrier, electrical connection carrier, and structural enclosure. This universal component replaces several separate parts (mounting plate, chamber covers, encapsulation material) with a single element that accomplishes all functions.
2Reliability
If multiple separate mounting plates and covers are used, then optical isolation is achieved, but the number of mounting steps increases
Solution Approach 1:
The patent combines multiple discrete mounting operations into a single integrated substrate assembly process. All chips are mounted directly on the substrate in one fabrication sequence, and the substrate itself provides the optical isolation, eliminating the need for separate chamber assembly steps and reducing the total number of mounting operations.
3Reliability
If separate chambers with opaque covers are used, then optical signal isolation is achieved, but external electrical connection becomes difficult
Solution Approach 1:
The substrate serves as both the optical isolation chamber and the electrical connection carrier. Electrical contacts are directly formed on the substrate surface, allowing external electrical connections to be made easily without requiring penetration or access through opaque covers, while the substrate simultaneously maintains optical isolation between chambers.
4Reliability
If large mounting plates and covers are used, then chip protection and optical isolation are achieved, but the overall package size becomes large
Solution Approach 1:
The patent combines the protective enclosure and mounting functions into a single compact substrate. The substrate provides chip protection through direct bonding and integrated encapsulation material, eliminating the need for large external covers while maintaining protection and optical isolation within a minimized footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, cost-effective electronic package that efficiently transmits and receives light radiation, suitable for use in proximity detectors, such as in mobile phones, by simplifying the structure and reducing the number of mounting steps.
Implementation Method 1
a transparent encapsulation block which extends between a rear face of the transparent plate and a front face of the receiving chip and between a rear face of the transparent plate and a front face of the substrate wafer, embedding the transmitting chip
Implementation Method 2
an opaque encapsulation block of the transparent encapsulation means, this opaque encapsulation block extending over a front face of the transparent plate and having a front through opening which reveals a front area of the transparent plate
Data Source
AI summary
An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.