Optical Package Interposer Layout for PIC-EIC Signal Conversion
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical components for signal conversion and processing, particularly in devices that require both long-range optical and short-range electrical signal transmission and processing.
Innovation Solution
The development of a photonic integrated circuit (PIC) with a silicon-on-insulator substrate, incorporating optical components such as waveguides, couplers, and modulators, and an electronic integrated circuit (EIC) bonded to a thinned interposer, supported by a silicon support structure, allowing for efficient signal conversion and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical components are integrated in separate packages, then each component can be optimized independently, but the overall device size increases and signal conversion efficiency decreases
Solution Approach 1:
The patent merges optical components (photonic die) and electrical components (electronic die) into a single integrated package, allowing direct coupling between optical waveguides and electrical interconnects. This integration eliminates the need for separate optical and electrical packages, thereby improving signal conversion efficiency while managing device complexity through systematic design.
Solution Approach 2:
The patent introduces an interposer as an intermediary component that facilitates coupling between the photonic die and electronic die. The interposer provides a platform for bonding both types of components and routing signals between them, enabling efficient optical-to-electrical signal conversion while maintaining modular design advantages.
2Length of stationary object
If optical fiber is used for long-range transmission, then transmission distance increases, but integration with electrical processing components becomes more difficult
Solution Approach 1:
The patent combines long-range optical transmission capabilities (via optical fiber coupling) with short-range electrical processing components within a single integrated package. The photonic die includes waveguides that can couple to external optical fibers, while the electronic die provides processing functionality, achieving both long transmission distance and ease of integration.
Solution Approach 2:
The interposer serves as a mediator that facilitates the integration of optical fiber interfaces with electrical processing components. It provides bonding surfaces and interconnect structures that enable seamless coupling between optical waveguides and electrical circuits, simplifying the manufacturing process.
3Speed
If electrical signals are used for short-range transmission, then processing speed improves, but signal loss increases over longer distances
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission for long-range communication paths. The photonic die handles optical signals that can travel longer distances with lower loss, while the electronic die handles electrical signals for high-speed local processing, optimizing both speed and signal integrity.
Data Source
AI summary
Optical devices and methods of manufacture are presented herein. In an embodiment, an optical device is provided that includes an optical package having a first surface and a second surface opposite the first surface, a laser die package having a third surface and a fourth surface opposite the third surface, wherein the first surface is planar with the third surface and the second surface is planar with the fourth surface, a first silicon support attached to both the second surface and the fourth surface, and an interposer attached to both the first surface and the third surface, wherein the interposer is free of a silicon substrate.