Optical Semiconductor Package With Stacked Dies and Lid Cooling
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Solution Overview
Problem
Current copper data channels face limitations due to signal attenuation and crosstalk, which are only partially mitigated by existing techniques like equalization, coding, and shielding, and optical communication systems are complex and expensive to manufacture.
Innovation Solution
The development of a semiconductor package with a photonic integrated circuit die and an electronic integrated circuit die, where the photonic die receives and transmits optical signals and communicates electronically with the electronic die, optimized for high-speed I/O and optical power delivery, using a stacked structure on a substrate with a lid structure to encapsulate and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical communication systems are used to overcome copper channel limitations, then signal transmission quality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines photonic integrated circuit die and electronic integrated circuit die into a single semiconductor package, merging optical signal generation/modulation with electronic processing functions. This integration reduces the number of discrete components and simplifies manufacturing while maintaining high-quality optical transmission capabilities.
Solution Approach 2:
The semiconductor package serves multiple functions simultaneously: it generates optical signals, processes electronic data, manages heat dissipation through specialized structures, and provides mechanical protection. This multi-functionality eliminates the need for separate systems, reducing overall manufacturing complexity.
2Reliability
If copper data channels use shielding and equalization to reduce signal attenuation and crosstalk, then transmission reliability is improved, but power consumption and system complexity increase
Solution Approach 1:
The patent replaces electrical signal transmission through copper channels with optical signal transmission through photonic integrated circuits. This substitution eliminates the need for electrical shielding and equalization techniques, significantly reducing power consumption while maintaining or improving transmission reliability.
3Temperature
If stacked structure with lid structure is used to enhance heat dissipation, then thermal management is improved, but device complexity increases
Solution Approach 1:
The semiconductor package divides thermal management functions into distinct layers: the stacked die structure provides vertical heat pathways, while the lid structure provides a large surface area for heat dissipation. This segmentation of thermal management functions improves efficiency while keeping each component relatively simple.
Solution Approach 2:
The lid structure adds a third dimension to heat dissipation by providing a large top surface area for heat release, complementing the vertical heat pathways through the stacked die. This dimensional approach to thermal management improves efficiency without requiring complex internal heat sink structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved scalability and efficiency in data transmission while reducing the complexity and cost associated with optical communication systems, addressing the limitations of copper data channels and enhancing heat dissipation and packaging efficiency.
Implementation Method 1
a coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure
Implementation Method 2
The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure
Implementation Method 3
enhance heat dissipation
Data Source
AI summary
A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.