Optical Integrated Package Layout for Shorter Electrical Paths
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Solution Overview
Problem
There is a need for packages that provide improved performance and a more compact form factor to be implemented in smaller devices, particularly in integrating optical integrated devices with other components.
Innovation Solution
A package design comprising a first package substrate, a second package substrate coupled through solder interconnects, integrated devices connected via solder interconnects, an encapsulation layer, post interconnects, and an optical integrated device with an optical fiber, which reduces electrical path distance and IR drop, enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical integrated device is integrated with other components in a package, then device functionality and performance are improved, but package size and complexity increase
Solution Approach 1:
The patent combines optical integrated devices with electronic integrated devices, substrates, and interconnect structures into a single integrated package. The optical device is mounted on the substrate and electrically connected through integrated interconnect structures, merging multiple functional components into one unified package that improves performance while managing complexity through systematic integration.
Solution Approach 2:
The package structure is designed to accommodate both optical and electronic integrated devices simultaneously. The substrate and interconnect structures serve multiple functions: providing mechanical support, enabling electrical connections, facilitating optical signal transmission, and allowing thermal management. This multi-functional design improves overall device capability without proportionally increasing complexity.
2Loss of energy
If electrical path distance is reduced to minimize IR drop, then power efficiency and performance are improved, but package layout constraints increase
Solution Approach 1:
The patent utilizes three-dimensional packaging arrangements where integrated devices are stacked or positioned at different vertical levels on the substrate. Post interconnects extend vertically through encapsulation layers to connect devices across different planes. This vertical dimensionality reduces the horizontal electrical path distance, minimizing IR drop while organizing complex connections in a structured spatial arrangement.
Solution Approach 2:
The substrate serves as an intermediary platform that provides integrated interconnect structures, including post interconnects extending through encapsulation layers. These intermediary structures facilitate short electrical paths between optical and electronic devices while managing the complexity of interconnections through standardized interface designs and systematic routing.
3Adaptability or versatility
If multiple substrates and integrated devices are integrated, then functional capability is improved, but manufacturing complexity increases
Solution Approach 1:
The package is divided into distinct segments including first and second substrates, optical integrated devices, electronic integrated devices, and encapsulation layers. Each segment can be manufactured and prepared separately using optimized processes, then assembled into the final package. This segmentation allows specialized manufacturing for each component type while simplifying the overall assembly process through modular integration.
Solution Approach 2:
Substrates and integrated devices are prepared in advance with pre-formed interconnect structures, mounting surfaces, and alignment features before final package assembly. The post interconnects are formed extending through encapsulation layers in advance, and electrical connections are established through pre-configured solder bumps and metallization patterns. This preliminary preparation reduces manufacturing complexity during the final integration stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves performance by minimizing electrical path distance and IR drop, facilitating better integration of optical and electrical signals, and enabling a more compact form factor.
Implementation Method 1
a first package substrate; a second package substrate coupled to the first package substrate through a first plurality of solder interconnects; a first integrated device coupled to the second package substrate through a second plurality of solder interconnects
Implementation Method 2
an optical integrated device coupled to the first package substrate; and an optical fiber coupled to the optical integrated device
Data Source
AI summary
A package comprising a package substrate; a first integrated device coupled to the package substrate through a first plurality of solder interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a plurality of post interconnects at least partially located in the encapsulation layer; a metallization portion coupled to the plurality of post interconnects; a second integrated device coupled to the metallization portion through a second plurality of solder interconnects; an optical integrated device coupled to the package substrate; and an optical fiber coupled to the optical integrated device.