Optical Package Structure with Spacer and Lateral Encapsulant
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Solution Overview
Problem
The existing optical package structures are thick due to encapsulant coverage on top surfaces, leading to increased thickness and production costs, and require additional supporting structures for panels, which complicates manufacturing.
Innovation Solution
An optical package structure with a spacer surrounding the optical element and encapsulant, where the encapsulant is only on the lateral surfaces, allowing a panel to be supported by the spacer without covering the active area, thus reducing thickness and production complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulant covers the optical element including top surface, then the optical element is protected, but the package thickness increases
Solution Approach 1:
The encapsulant is selectively applied to cover only the lateral surfaces of the optical element while leaving the top surface exposed. This local differentiation allows the optical element to be protected from lateral damage while maintaining a thin profile, as the encapsulant does not extend over the top surface where it would increase thickness.
2Reliability
If encapsulant covers the top surface of optical element, then the optical element is fully protected, but the active area is blocked
Solution Approach 1:
The encapsulant coverage is locally differentiated to protect lateral surfaces while intentionally leaving the top surface and active area exposed. This selective coverage ensures the active area remains accessible for optical operations while still providing protection where needed.
3Ease of operation
If panel is placed on top surface of encapsulant, then the panel is supported, but additional supporting structures are required
Solution Approach 1:
The spacer structure serves multiple functions: it provides mechanical support for the panel, maintains the thin profile of the package, and creates a stable mounting surface. By making the spacer multi-functional, additional dedicated supporting structures are eliminated, reducing overall device complexity.
4Ease of operation
If removable mold is used to form opening, then the active area is exposed, but production complexity and cost increase
Solution Approach 1:
The encapsulant is applied in a preliminary stage to cover only lateral surfaces, with the top surface intentionally left exposed from the beginning. This preliminary configuration eliminates the need for subsequent mold removal steps, simplifying the production process and reducing costs while achieving the same result of exposing the active area.
Data Source
AI summary
An optical package structure includes a substrate, an optical element, a spacer and an encapsulant. The substrate has a top surface. The optical element is disposed adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is disposed between the optical element and the spacer, and has a third height H3 at a position adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2>H1≥H3.