Optical Package Venting Structure to Prevent Support Layer Deformation
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Solution Overview
Problem
Conventional optical package structures face issues with deformation of the supporting layer due to thermal expansion of air in the enclosed space during high-temperature manufacturing processes, leading to reduced product yield and reliability.
Innovation Solution
The optical package structure incorporates a substrate, an optical chip with a pressure channel, a ring-shaped supporting layer, a light-permeable layer, and an encapsulant. The pressure channel, with entrances on the outer and inner spacing regions of the optical chip, allows for pressure equalization and reduces the impact of thermal expansion on the supporting layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the optical package structure uses an enclosed space with supporting layer between optical chip and light-permeable layer, then the structure provides mechanical support and component alignment, but the supporting layer deforms during high-temperature manufacturing due to thermal expansion of air in the enclosed space
Solution Approach 1:
The patent extracts the air from the enclosed space by providing a pressure channel that communicates the air chamber with the external environment. This removes the harmful factor (air) that causes thermal expansion and supporting layer deformation during high-temperature manufacturing, while maintaining the mechanical support function of the supporting layer.
Solution Approach 2:
The pressure channel acts as an intermediary structure that connects the enclosed air chamber with the external environment. This mediator allows pressure equalization during temperature changes, preventing the air expansion that would otherwise cause supporting layer deformation, while not interfering with the mechanical support function.
2Reliability
If the pressure channel aperture is made larger to improve pressure equalization, then thermal expansion effects are reduced, but the structural integrity and light-tightness of the optical chip are compromised
Solution Approach 1:
The patent optimizes the pressure channel aperture to specific parameter ranges (0.2-10 μm) that balance two competing requirements: large enough to allow effective pressure equalization and air evacuation during temperature changes, but small enough to maintain structural integrity and light-tightness of the optical chip.
Solution Approach 2:
The pressure channel is selectively positioned in the outer spacing region of the optical chip, away from the optical region and carrying region. This local placement allows pressure equalization functionality without compromising the structural integrity and light-tightness of the critical optical areas.
3Reliability
If the encapsulant fully encloses the pressure channel entrance, then environmental protection is improved, but pressure equalization function is lost
Solution Approach 1:
The encapsulant is designed to enclose the first entrance of the pressure channel but deliberately not extend into the pressure channel itself. This extraction approach allows the encapsulant to provide environmental protection for the chip while leaving the pressure channel pathway open for pressure equalization during temperature changes.
Solution Approach 2:
The encapsulant structure is segmented to distinguish between the region that requires environmental protection (the chip and its interfaces) and the pressure channel pathway that requires remaining open for pressure equalization. This segmentation allows both functions to coexist without interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents deformation of the ring-shaped supporting layer during high-temperature manufacturing, thereby enhancing the product yield and reliability of the optical package structure.
Implementation Method 1
when the conventional optical package structure is manufactured under a high-temperature condition, the heat causes air in the enclosed space to expand
Data Source
AI summary
An optical package structure includes a substrate, an optical chip disposed on the substrate, a ring-shaped supporting layer disposed on the optical chip, a light-permeable layer disposed on the ring-shaped supporting layer, and an encapsulant formed on the substrate. The optical chip has a pressure channel arranged therein. Two ends of the pressure channel are respectively arranged on an outer surface of the optical chip and are respectively located at two opposite sides of the ring-shaped supporting layer. The light-permeable layer, the ring-shaped supporting layer, and the optical chip are embedded in the encapsulant and jointly define an air chamber that is in fluid communication with the pressure channel. The encapsulant encloses the pressure channel, and the air chamber is enclosed.